Shaikh S. Ahmed;Ahmad E. Islam;Daniel M. Dryden;Kyle J. Liddy;Nolan S. Hendricks;Neil A. Moser;Kelson D. Chabak;Andrew J. Green
{"title":"利用基于物理的 TCAD 仿真确定的 $beta $-Ga$_{\\text{2}}$O$_{\\text{3}}$ 侧向功率晶体管的理论功率特性图","authors":"Shaikh S. Ahmed;Ahmad E. Islam;Daniel M. Dryden;Kyle J. Liddy;Nolan S. Hendricks;Neil A. Moser;Kelson D. Chabak;Andrew J. Green","doi":"10.1109/TED.2024.3436711","DOIUrl":null,"url":null,"abstract":"We calculated power figure-of-merit (PFoM) in \n<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>\n-Ga2O3-based lateral metal-semiconductor field-effect transistors (MESFETs) by simulating the current-voltage (I–V) and breakdown characteristics. Simulation results were benchmarked with the characteristics measured on similar devices. For theoretical analysis, we used atomistic analysis of carrier mobility, self-consistent simulation of electrostatics and carrier transport, and a refined impact ionization model. Our analysis revealed the importance of considering off-state leakage mechanism, 2-D electrostatics, and current conduction pathways for majority and (generated) minority carriers for avalanche breakdown simulation in \n<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>\n-Ga2O3 lateral MESFETs. This is a significant advancement over the electric field-based approach that is used in literature for breakdown studies. This study also highlights the importance of considering extrinsic breakdown pathways that often limit the observation of avalanche breakdown in these devices.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Theoretical Power Figure-of-Merit in β -Ga2O3 Lateral Power Transistors Determined Using Physics-Based TCAD Simulation\",\"authors\":\"Shaikh S. Ahmed;Ahmad E. Islam;Daniel M. Dryden;Kyle J. Liddy;Nolan S. Hendricks;Neil A. Moser;Kelson D. Chabak;Andrew J. Green\",\"doi\":\"10.1109/TED.2024.3436711\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We calculated power figure-of-merit (PFoM) in \\n<inline-formula> <tex-math>$\\\\beta $ </tex-math></inline-formula>\\n-Ga2O3-based lateral metal-semiconductor field-effect transistors (MESFETs) by simulating the current-voltage (I–V) and breakdown characteristics. Simulation results were benchmarked with the characteristics measured on similar devices. For theoretical analysis, we used atomistic analysis of carrier mobility, self-consistent simulation of electrostatics and carrier transport, and a refined impact ionization model. Our analysis revealed the importance of considering off-state leakage mechanism, 2-D electrostatics, and current conduction pathways for majority and (generated) minority carriers for avalanche breakdown simulation in \\n<inline-formula> <tex-math>$\\\\beta $ </tex-math></inline-formula>\\n-Ga2O3 lateral MESFETs. This is a significant advancement over the electric field-based approach that is used in literature for breakdown studies. This study also highlights the importance of considering extrinsic breakdown pathways that often limit the observation of avalanche breakdown in these devices.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10630667/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10630667/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Theoretical Power Figure-of-Merit in β -Ga2O3 Lateral Power Transistors Determined Using Physics-Based TCAD Simulation
We calculated power figure-of-merit (PFoM) in
$\beta $
-Ga2O3-based lateral metal-semiconductor field-effect transistors (MESFETs) by simulating the current-voltage (I–V) and breakdown characteristics. Simulation results were benchmarked with the characteristics measured on similar devices. For theoretical analysis, we used atomistic analysis of carrier mobility, self-consistent simulation of electrostatics and carrier transport, and a refined impact ionization model. Our analysis revealed the importance of considering off-state leakage mechanism, 2-D electrostatics, and current conduction pathways for majority and (generated) minority carriers for avalanche breakdown simulation in
$\beta $
-Ga2O3 lateral MESFETs. This is a significant advancement over the electric field-based approach that is used in literature for breakdown studies. This study also highlights the importance of considering extrinsic breakdown pathways that often limit the observation of avalanche breakdown in these devices.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.