大尺寸非晶 InGaZnO TFT 在正向和反向重叠动态应力作用下的不对称降解行为

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-08-06 DOI:10.1109/TED.2024.3435174
Ruohong Duan;Zhixiang Zou;Zhong Xu;Haoxiong Zhang;Xibin Shao;Deming Zhang;Zhangtao Wang;Lang Zeng
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引用次数: 0

摘要

本文揭示了大尺寸非晶 InGaZnO(a-IGZO)薄膜晶体管(TFT)在有源驱动电路的实际波形下的退化行为,并分析了相应的退化机制。当漏极脉冲的后半段与栅极脉冲的前半段重叠(正向重叠)时,自热效应成为阈值电压正向偏移的关键因素。当漏极脉冲的前半部分与栅极脉冲的后半部分重叠时(后向重叠),热载流子效应比自热效应起主导作用。在这种情况下,热载流子效应会产生难以恢复的深态,导致正电压偏移和导通电流恶化。然而,稍稍提高脉冲频率,自热效应就会在向后重叠中再次占据主导地位。为了理解这一现象,我们提出了自热效应和热载流子效应之间的竞争模型,该模型显示了 a-IGZO 驱动晶体管的大 W/L 比所起的重要作用。该模型可能适用于栅极驱动阵列(GOA)驱动电路应用中的 a-IGZO TFT 退化分析。
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Asymmetry Degradation Behavior Under Forward and Backward Overlap Dynamical Stress in Large-Size Amorphous InGaZnO TFT
In this work, the degradation behaviors for large size amorphous InGaZnO (a-IGZO) thin-film transistors (TFTs) under realistic waveforms in active driving circuit are revealed, and the corresponding degradation mechanisms are analyzed. When the back half of the drain pulse overlaps with the first half of the gate pulse (forward overlap), self-heating effect becomes the key factor for positive threshold voltage shift. When the front half of the drain pulse overlaps with the back half of the gate pulse (backward overlap), hot carrier effect takes the dominating role over self-heating. Under this circumstance, hot carrier effect could generate deep states, which are hard to recover, causing both positive voltage shift and ON-current deterioration. However, slightly increasing the pulse frequency leads to self-heating effect taking over again in backward overlap. To understand this phenomenon, a competition model between self-heating and hot carrier effect is proposed, which indicates the significant role played by the large W/L ratio of the a-IGZO driving transistor. The model might be suitable for degradation analysis of a-IGZO TFTs in gate driven on array (GOA) driving circuits application.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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