Evaluation of the shear bond strength between CAD/CAM blocks and sonic/thermoviscous bulk-fill composites with different surface treatments

Background/purpose

To evaluate the shear bond strength (SBS) of nanoceramic hybrid CAD/CAM blocks with two bulk-fill composites in deep margin elevation following different surface pretreatments.

Materials and methods

Forty cylindrical-shaped samples (3 mm diameter × 4 mm height) were prepared from each group of bulk-fill resin composites (BRC) (SonicFill 3/SF, VisCalor bulk/VS), and 80 samples (14.5 mm × 7.2 mm × 2 mm) were sectioned from Grandio Block. Specimens of each BRC were assigned to two subgroups, and surfaces of one group were treated with a tribochemical silica-coating. The CAD/CAM block sample surfaces were treated with Al₂O₃ particles. CAD/CAM block and composite samples were luted using dual-cure universal resin-based cement (Bifix QM). Following immersion in distilled water for 24 h, the samples were divided as immediate and test groups. The test group was subjected to thermocycle (5–55 °C, 10,000 cycles). The SBS of the resin-based cement between the blocks and BRC was tested on a universal testing device until failure. Failure type was determined using a stereomicroscope. The roughening pattern was evaluated with SEM. Statistical analysis included Shapiro Wilk, Generalized Linear Models, and Fisher's Exact tests (P < 0.05).

Results

No statistically significant difference was found between the mean SBS values according to deep margin elevation materials and surface pretreatment (P > 0.05). Aging procedure resulted in a statistically significant difference between the mean SBS values (P < 0.001). While the mean SBS value was 33.7 ± 7.9 MPa in immediate group, it was calculated as 22.6 ± 6.3 MPa in test group following thermocycle.

Conclusion

In terms of SBS, both bulk-fill resin composites performed similarly. Although higher SBS values were obtained with tribochemical silica-coating, the adverse effects of thermocycling on bonding could not be prevented.