量化孔隙空间均匀性:等离子刻蚀前后在膜上的应用

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Micro and Nano Engineering Pub Date : 2024-07-31 DOI:10.1016/j.mne.2024.100278
E.-M. Papia , V. Constantoudis , D. Ioannou , A. Zeniou , Y. Hou , P. Shah , M. Kappl , E. Gogolides
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引用次数: 0

摘要

膜在过滤和组织工程等各种应用中发挥着至关重要的作用。膜性能优化的重要性凸显了准确表征孔结构的必要性。传统的孔径分布方法被广泛用于量化孔径均匀性。然而,均匀性综合了尺寸和空间孔隙结构两个方面,因此需要互补技术的协同作用来分析孔隙结构。这项研究利用随机几何,特别是近邻指数(NNI)来评估膜扫描电子显微镜(SEM)图像中孔隙的空间均匀性。通过对等离子蚀刻前后的聚四氟乙烯(PTFE)以及纳米纤丝涂层聚醚砜(PES)膜进行综合分析,该分析通过孔结构和孔空间排列增强了我们对膜形态的理解。研究结果表明,放大倍数的增加会导致明显的空间均匀性下降,这表明在分析中纳入更细小的孔系列会产生影响。与完全随机的情况相比,几乎在所有情况下,NNI 值都显示出更高的均匀性。此外,研究还发现等离子体蚀刻对空间均匀性的影响并不显著,只是在孔隙中心点排列上引入了轻微的均匀性,这反映在 NNI 的小幅增加上。此外,孔隙区域洗牌技术揭示了孔隙密度和大小对空间均匀性的影响,突出了所研究材料的固有模式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Quantifying pore spatial uniformity: Application on membranes before and after plasma etching

Membranes play a critical role in diverse applications, including filtration and tissue engineering. The importance of membrane performance optimization highlights the necessity of accurately characterizing the pore structure. Traditional Pore Size Distribution methodologies are widely used to quantify size uniformity. Uniformity though, integrates both size and spatial pore structure aspects, thus necessitating the synergy of complementary techniques to analyze pore structure. This work empowers classic pore metrology with stochastic geometry, specifically the Nearest Neighbour Index (NNI) to assess the spatial uniformity of pores in membrane Scanning Electron Microscopy (SEM) images. Through a comprehensive analysis of Polytetrafluoroethylene (PTFE) before and after plasma etching, along with nanofilament coated Polyethersulfone (PES) membranes, this analysis enhances our understanding of membrane morphology through pore structure and pore spatial arrangement. The findings indicate that increasing magnification leads to a decrease in apparent spatial uniformity, indicative of effects regarding the inclusion in analysis of families of finer pores. In almost all cases, NNI values show higher uniformity compared to a fully random scenario. Additionally, it is found that plasma etching does not have significant effects on spatial uniformity introducing only a slight uniformity in pore centroid arrangement, reflected in a small NNI increase. Furthermore, a pore area shuffling technique reveals the effects of pore density and size on spatial uniformity, highlighting patterns inherent to the materials under study.

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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
期刊最新文献
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