Detection of indentation damage in carbon fiber/epoxy composites via EIT during the application of bending loads

Electrical impedance tomography (EIT) is a method of spatially mapping the conductivity distribution of a domain and has been studied as a potential embedded sensing or nondestructive evaluation (NDE) tool. An often touted advantage of EIT is that it can be used in-situ; that is, because the method only requires the application of unobtrusive electrodes, it can conceivably be used while the component or structure is in operation. This material-as-the-sensor philosophy strongly aligns with key components of the NDE 4.0 vision such as the realization of intelligent cyber–physical systems (CPS) and digital twins. To date, however, the claim of in-situ sensing via EIT has not been significantly substantiated. This is problematic because operational loads induce strains that often change the conductivity of the material. Establishing that EIT can detect damage-induced conductivity changes through the presence of unrelated strain-induced conductivity changes is therefore important. To that end, we herein study the application of EIT for detecting indentation damage in a carbon fiber/epoxy composite as the composite is loaded in a four-point bend. It was found that the bending load changes the contact impedance of the electrodes, which resulted in poor EIT images when solving the EIT inverse problem with the ${\ell }_2$-norm on the error term. Using the ${\ell }_1$-norm on the error term, solved via the primal–dual interior point method (PDIPM), significantly improved image quality. Image quality was even further improved through the use of a mixed prior for regularization, and EIT images were compared to thermography with good agreement. These results show that EIT can indeed detect damage through the presence of an applied load, but care must be taken to account for factors such as outlier data arising from electrode degradation and changing contact impedance. Use of the ${\ell }_1$-norm on the error term is therefore highly recommended for in-situ imaging via EIT.