采用局部背面蚀刻技术的 56% PAE 毫米波 SiGe BiCMOS 功率放大器

0 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE microwave and wireless technology letters Pub Date : 2024-06-14 DOI:10.1109/LMWT.2024.3409149
Aniello Franzese;Batuhan Sutbas;Raqibul Hasan;Andrea Malignaggi;Thomas Mausolf;Nebojsa Maletic;Muh-Dey Wei;Han Zhou;Christian Fager;Corrado Carta;Renato Negra
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引用次数: 0

摘要

本文介绍了一种功率放大器(PA),它具有出色的功率附加效率(PAE),适用于毫米波(mm-wave)应用。这种高效率是通过利用局部背面蚀刻 (LBE) 工艺来提高输出匹配网络的品质因数 (Q) 实现的。功率放大器采用成熟的 SiGe BiCMOS 技术制造,采用异质结双极晶体管 (HBT),具有 $ {f}_{T} / {f}_\{m}。/ {f}_\{max }。为 250/340 GHz。虽然测得的峰值 PAE 在 24 和 25 GHz 时为 56%,但功率放大器提供了 16 dB 的峰值增益和 19 GHz 的 3 dB 带宽(从 13.5 GHz 到 32.5 GHz),这使得该电路非常适合传感器、雷达、5G 和卫星通信等多种用途。22 至 28 GHz 的最大 PAE 超过 40%,25 GHz 时的峰值饱和功率($ {P}_{text {sat}} $ )为 16.5 dBm。据作者所知,该功率放大器达到了迄今为止硅基毫米波放大器的最高 PAE。
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56% PAE mm-Wave SiGe BiCMOS Power Amplifier Employing Local Backside Etching
This letter presents a power amplifier (PA) with excellent power-added efficiency (PAE) for millimeter-wave (mm-wave) applications. The high efficiency is achieved by leveraging a local backside etching (LBE) process to enhance the quality factor (Q) of the output matching network. The PA was fabricated in a mature SiGe BiCMOS technology featuring heterojunction bipolar transistors (HBTs) having an $ {f}_{T} / {f}_{\max } $ of 250/340 GHz. While the measured peak PAE is 56% at 24 and 25 GHz, the PA provides 16 dB of peak gain and a 3-dB bandwidth of 19 GHz ranging from 13.5 to 32.5 GHz, which makes the circuit well suited for multiple purposes, such as sensors, radars, 5G, and satellite communications. The maximum PAE exceeds 40% from 22 to 28 GHz, with a peak saturated power ( $ {P}_{\text {sat}} $ ) of 16.5 dBm at 25 GHz. To the best of authors’ knowledge, this PA achieves the highest PAE reported to date for silicon-based mm-wave amplifiers.
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