在代工 CMOS 中使用天线耦合肖特基势垒二极管进行 20-THz 远红外成像

0 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE microwave and wireless technology letters Pub Date : 2024-07-01 DOI:10.1109/LMWT.2024.3418455
Behnam Pouya
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引用次数: 0

摘要

本文介绍了一种 20 太赫兹(THz)远红外(FIR)成像器的实现情况,该成像器采用天线耦合肖特基势垒二极管(SBD)结构,在 130 纳米晶圆代工 CMOS 工艺中制造而成,无需对工艺进行任何修改。使用 15.1- $\mu $ m 量子级联激光器(QCL)光源对探测器的性能进行了鉴定。在 13 Hz 的调制频率下,该探测器的峰值光响应率($R_{v}$ )达到 35.2 V/W,是在类似频率范围内工作的 CMOS 探测器的六倍。测得的射噪限制噪声等效功率(NEP)为 1.8 nW/ $\surd $ Hz,与面积大 47000 倍的市售热电堆探测器相当。
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20-THz Far-Infrared Imaging Using an Antenna-Coupled Schottky Barrier Diode in a Foundry CMOS
This letter presents the implementation of a 20-terahertz (THz) far-infrared (FIR) imager using an antenna-coupled Schottky barrier diode (SBD) structure fabricated in a 130-nm foundry CMOS process without any process modifications. The detector’s performance is characterized using a 15.1- $\mu $ m quantum-cascade laser (QCL) source. At a modulation frequency of 13 Hz, the detector achieves a peak optical responsivity ( $R_{v}$ ) of 35.2 V/W, which is ~six times higher than that of CMOS detectors operating in a similar frequency range. The measured shot-noise limited noise equivalent power (NEP) is 1.8 nW/ $\surd $ Hz, which is comparable to that of commercially available thermopile detectors that are 47000 times larger in area.
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