碳纤维的表面物理和化学性质通过电沉积铜提高碳纤维增强塑料的异种板材连接性能

IF 3 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Materialia Pub Date : 2024-08-10 DOI:10.1016/j.mtla.2024.102208

Masataka Hakamada, Koji Naito, Mamoru Mabuchi

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引用次数: 0

摘要

通过电沉积铜，将碳纤维增强塑料 (CFRP) 板材与阳极氧化 A6061 铝合金板材进行异种边缘连接。经过一系列预处理，包括在 KMnO4 + NaOH 热水溶液中蚀刻、在 1 mol L˗1 H2SO4 中以 2 V 对 SUS316 阴极进行阳极氧化，以及在热浓 H2SO4 中进行磺化，达到了 137 MPa 的高粘接强度。阳极氧化对 CFRP 中的碳纤维 (CF) 表面进行了物理清洗。阳极氧化还改变了碳纤维的化学表面特性，引入了结晶缺陷和 CO 基团。对 CFRP 中的碳纤维进行这种物理和化学修饰后，电沉积铜的附着力良好。

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Surface physics and chemistry of carbon fibers enhance dissimilar sheet joining of carbon fiber-reinforced plastic by copper electrodeposition

Carbon fiber-reinforced plastic (CFRP) sheets were dissimilarly edge-joined with anodized A6061 Al alloy sheets by copper electrodeposition. A high bonding strength of 137 MPa was attained following a series of pretreatments including etching in KMnO₄ + NaOH hot aqueous solution, anodization at 2 V vs. SUS316 cathode in 1 mol L^˗1 H₂SO₄, and sulfonation in hot concentrated H₂SO₄. The anodization physically cleaned the carbon fiber (CF) surface in CFRP. The chemical surface properties of the CFs were modified by the anodization, introducing crystallographic defects and CO groups. This physical and chemical modification of CFs in CFRP resulted in good adhesion of the electrodeposited copper.

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来源期刊

Materialia MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

6.40

自引率

2.90%

发文量

345

审稿时长

36 days

期刊介绍： Materialia is a multidisciplinary journal of materials science and engineering that publishes original peer-reviewed research articles. Articles in Materialia advance the understanding of the relationship between processing, structure, property, and function of materials. Materialia publishes full-length research articles, review articles, and letters (short communications). In addition to receiving direct submissions, Materialia also accepts transfers from Acta Materialia, Inc. partner journals. Materialia offers authors the choice to publish on an open access model (with author fee), or on a subscription model (with no author fee).