{"title":"用于 DRAM 应用的 FeRAM 位单元设计空间探索","authors":"Hyungrock Oh;Yang Xiang;Fernando Garcia Redondo;Mohit Kumar Gupta;Manu Perumkunnil;Marie Garcia Bardon;Amit Dhiman;Sathisha Nanjunde Gowda;Amey Walke;Andrea Fantini;Farrukh Yasin;Gouri Sankar Kar;Geert Hellings;Wim Dehaene","doi":"10.1109/TED.2024.3435630","DOIUrl":null,"url":null,"abstract":"HfOx-based ferroelectric random access memories (FeRAMs) have been proposed as a promising candidate to further dynamic random access memory (DRAM) scaling. This article presents a bitcell design space exploration of HfZrOx-based FeRAM based on a 2T1C testbench representative of a 64-kb 1T1C subarray at 40-nm CMOS technology. We first explore the impact of ferroelectric capacitor (FeCAP) sizing on the read sensing margin (SM) and speed with eight different blocks in the subarray, supported by a hardware-calibrated FeCAP compact model. We identify the capacitance ratio (\n<inline-formula> <tex-math>${C} _{\\text {R}}$ </tex-math></inline-formula>\n) between the bitline parasitic capacitance (\n<inline-formula> <tex-math>${C} _{\\text {BL}}$ </tex-math></inline-formula>\n) and the FeCAP capacitance (\n<inline-formula> <tex-math>${C} _{\\text {FE}}$ </tex-math></inline-formula>\n) as the critical design parameter for bitcell SM optimization, with a maximum \n<inline-formula> <tex-math>${C} _{\\text {R}}$ </tex-math></inline-formula>\n of 41 permitted for the given FeCAP technology. Furthermore, we investigate the impact of FeCAP sizing on ferro-grain granularity (FGG)-induced variability. Our findings clarify that SM variability worsens with increasing FeCAP size but does not significantly affect the readability overall. Additionally, we examine the consequences of FeCAP sizing on disturbance effects during write operations, concluding that larger FeCAPs help mitigate write disturbances by reducing voltage transfer to half-selected (HS) cells.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design Space Exploration of FeRAM Bit Cell for DRAM Application\",\"authors\":\"Hyungrock Oh;Yang Xiang;Fernando Garcia Redondo;Mohit Kumar Gupta;Manu Perumkunnil;Marie Garcia Bardon;Amit Dhiman;Sathisha Nanjunde Gowda;Amey Walke;Andrea Fantini;Farrukh Yasin;Gouri Sankar Kar;Geert Hellings;Wim Dehaene\",\"doi\":\"10.1109/TED.2024.3435630\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"HfOx-based ferroelectric random access memories (FeRAMs) have been proposed as a promising candidate to further dynamic random access memory (DRAM) scaling. This article presents a bitcell design space exploration of HfZrOx-based FeRAM based on a 2T1C testbench representative of a 64-kb 1T1C subarray at 40-nm CMOS technology. We first explore the impact of ferroelectric capacitor (FeCAP) sizing on the read sensing margin (SM) and speed with eight different blocks in the subarray, supported by a hardware-calibrated FeCAP compact model. We identify the capacitance ratio (\\n<inline-formula> <tex-math>${C} _{\\\\text {R}}$ </tex-math></inline-formula>\\n) between the bitline parasitic capacitance (\\n<inline-formula> <tex-math>${C} _{\\\\text {BL}}$ </tex-math></inline-formula>\\n) and the FeCAP capacitance (\\n<inline-formula> <tex-math>${C} _{\\\\text {FE}}$ </tex-math></inline-formula>\\n) as the critical design parameter for bitcell SM optimization, with a maximum \\n<inline-formula> <tex-math>${C} _{\\\\text {R}}$ </tex-math></inline-formula>\\n of 41 permitted for the given FeCAP technology. Furthermore, we investigate the impact of FeCAP sizing on ferro-grain granularity (FGG)-induced variability. Our findings clarify that SM variability worsens with increasing FeCAP size but does not significantly affect the readability overall. Additionally, we examine the consequences of FeCAP sizing on disturbance effects during write operations, concluding that larger FeCAPs help mitigate write disturbances by reducing voltage transfer to half-selected (HS) cells.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-08-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10634300/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10634300/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Design Space Exploration of FeRAM Bit Cell for DRAM Application
HfOx-based ferroelectric random access memories (FeRAMs) have been proposed as a promising candidate to further dynamic random access memory (DRAM) scaling. This article presents a bitcell design space exploration of HfZrOx-based FeRAM based on a 2T1C testbench representative of a 64-kb 1T1C subarray at 40-nm CMOS technology. We first explore the impact of ferroelectric capacitor (FeCAP) sizing on the read sensing margin (SM) and speed with eight different blocks in the subarray, supported by a hardware-calibrated FeCAP compact model. We identify the capacitance ratio (
${C} _{\text {R}}$
) between the bitline parasitic capacitance (
${C} _{\text {BL}}$
) and the FeCAP capacitance (
${C} _{\text {FE}}$
) as the critical design parameter for bitcell SM optimization, with a maximum
${C} _{\text {R}}$
of 41 permitted for the given FeCAP technology. Furthermore, we investigate the impact of FeCAP sizing on ferro-grain granularity (FGG)-induced variability. Our findings clarify that SM variability worsens with increasing FeCAP size but does not significantly affect the readability overall. Additionally, we examine the consequences of FeCAP sizing on disturbance effects during write operations, concluding that larger FeCAPs help mitigate write disturbances by reducing voltage transfer to half-selected (HS) cells.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.