利用电纺丝技术用壳聚糖-铜复合物和聚乙烯醇(PVA)混合制成的抗菌纳米纤维伤口敷料垫

Amir Parvinnasab , Sharareh Shahroudi , Erfan Salahinejad , Amir Hossein Taghvaei , Seyed Adel Sharifi Fard , Esmaeel Sharifi
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摘要

壳聚糖具有很高的生物相容性、生物降解性、止血、抗菌活性和促进组织再生的能力,因此在伤口护理解决方案中大有可为。然而,它的抗菌特性对于某些受感染的伤口和局部条件来说是不够的。鉴于铜具有很高的抗菌活性,这项工作的重点是合成壳聚糖-铜复合物,在壳聚糖的胺基上分别添加 1、3、6、12、24 和 48% 的铜,然后用聚乙烯醇对其进行电纺丝。这些垫子显示出良好的蒸汽转化率,从 2800±33 克/平方米.天到 3201±48 克/平方米.天不等,而且铜的释放是双相的,最初的释放是爆发式的,随后持续释放 7 天。在铜含量为 12% 的情况下,成纤维细胞的细胞相容性较好,而在铜含量为 6% 的情况下,成纤维细胞的再上皮化和细胞迁移速度加快。对革兰氏阳性金黄色葡萄球菌(S. aureus)和革兰氏阴性大肠杆菌(E. coli)的抗菌效果超过了 3%的铜。一般来说,铜的最佳浓度为 6%,在抗菌活性和生物相容性之间取得了平衡,仅在 24 小时内就能覆盖 98.0 ± 0.8% 的伤口面积,并在 5 天内使细胞增殖增加 189 ± 11%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Antibacterial nanofibrous wound dressing mats made from blended chitosan-copper complexes and polyvinyl alcohol (PVA) using electrospinning

Chitosan is promising for wound care solutions owing to its high biocompatibility, biodegradability, hemostasis, antimicrobial activity, and promotion of tissue regeneration. However, its antibacterial property is insufficient for some infected wounds and local conditions. Given the high antibacterial activity of copper, this work focused on synthesizing chitosan-copper complexes with 1, 3, 6, 12, 24, and 48 % copper to chitosan's amine groups, followed by electrospinning them with polyvinyl alcohol. The mats exhibited promising vapor transition rates ranging from 2800 ± 33 to 3201 ± 48 g/m2.day and a dual-phase release of copper, with an initial burst followed by a sustained release over 7 days. Superior fibroblast cell cytocompatibility was observed up to 12 % copper, with accelerated re-epithelialization and cell migration to 6 % copper. Antibacterial efficacy against both gram-positive Staphylococcus aureus)S. aureus(and gram-negative Escherichia coli (E. coli) bacteria was effective beyond 3 % copper. Typically, the optimal concentration of copper was identified at 6 %, exhibiting a balance of antibacterial activity and biocompatibility, with the ability to cover 98.0 ± 0.8 % of the wound area in only 24 h and increase cell proliferation by 189 ± 11 % within 5 days.

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