{"title":"采用 130 纳米 SiGe BiCMOS 工艺的 140 和 220-GHz 双频放大器","authors":"Letian Guo;Shuyang Li;Wenhua Chen;Shunli Ma;Junyan Ren","doi":"10.1109/TTHZ.2024.3430064","DOIUrl":null,"url":null,"abstract":"This article presents a concurrent dual-band power amplifier (PA) in 130-nm SiGe BiCMOS process. A three-stage stacked BJT amplifier configuration is employed to enhance both the power gain and the output power. To achieve dual-band low-loss matching, the subquarter-wavelength-based baluns are adopted to construct the input and output matching networks. In addition, multiorder \n<italic>LC</i>\n networks are introduced to achieve excellent dual-band interstage impedance matching. The proposed three-stage dual-band PA exhibits maximum small signal gains of 25.4 dB at 135 GHz and 21.6 dB at 210 GHz, with 3-dB bandwidths of 28 and 25 GHz, respectively. The measured results show a saturated power (Psat) of more than 13.1 dBm and 9.6 dBm and a power-added efficiency (PAE) of more than 6.75% and 3.1% over ranges of 126–154 GHz and 200–225 GHz, respectively. To the best of the authors’ knowledge, the proposed PA achieves the higher Psat and PAE value than other dual-band PA operating at frequencies greater than 100 GHz with silicon-based process.","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"14 5","pages":"768-773"},"PeriodicalIF":3.9000,"publicationDate":"2024-07-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A 140- and 220-GHz Dual-Band Amplifier in 130-nm SiGe BiCMOS Process\",\"authors\":\"Letian Guo;Shuyang Li;Wenhua Chen;Shunli Ma;Junyan Ren\",\"doi\":\"10.1109/TTHZ.2024.3430064\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article presents a concurrent dual-band power amplifier (PA) in 130-nm SiGe BiCMOS process. A three-stage stacked BJT amplifier configuration is employed to enhance both the power gain and the output power. To achieve dual-band low-loss matching, the subquarter-wavelength-based baluns are adopted to construct the input and output matching networks. In addition, multiorder \\n<italic>LC</i>\\n networks are introduced to achieve excellent dual-band interstage impedance matching. The proposed three-stage dual-band PA exhibits maximum small signal gains of 25.4 dB at 135 GHz and 21.6 dB at 210 GHz, with 3-dB bandwidths of 28 and 25 GHz, respectively. The measured results show a saturated power (Psat) of more than 13.1 dBm and 9.6 dBm and a power-added efficiency (PAE) of more than 6.75% and 3.1% over ranges of 126–154 GHz and 200–225 GHz, respectively. To the best of the authors’ knowledge, the proposed PA achieves the higher Psat and PAE value than other dual-band PA operating at frequencies greater than 100 GHz with silicon-based process.\",\"PeriodicalId\":13258,\"journal\":{\"name\":\"IEEE Transactions on Terahertz Science and Technology\",\"volume\":\"14 5\",\"pages\":\"768-773\"},\"PeriodicalIF\":3.9000,\"publicationDate\":\"2024-07-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Terahertz Science and Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10601494/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Terahertz Science and Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10601494/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A 140- and 220-GHz Dual-Band Amplifier in 130-nm SiGe BiCMOS Process
This article presents a concurrent dual-band power amplifier (PA) in 130-nm SiGe BiCMOS process. A three-stage stacked BJT amplifier configuration is employed to enhance both the power gain and the output power. To achieve dual-band low-loss matching, the subquarter-wavelength-based baluns are adopted to construct the input and output matching networks. In addition, multiorder
LC
networks are introduced to achieve excellent dual-band interstage impedance matching. The proposed three-stage dual-band PA exhibits maximum small signal gains of 25.4 dB at 135 GHz and 21.6 dB at 210 GHz, with 3-dB bandwidths of 28 and 25 GHz, respectively. The measured results show a saturated power (Psat) of more than 13.1 dBm and 9.6 dBm and a power-added efficiency (PAE) of more than 6.75% and 3.1% over ranges of 126–154 GHz and 200–225 GHz, respectively. To the best of the authors’ knowledge, the proposed PA achieves the higher Psat and PAE value than other dual-band PA operating at frequencies greater than 100 GHz with silicon-based process.
期刊介绍:
IEEE Transactions on Terahertz Science and Technology focuses on original research on Terahertz theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of Terahertz waves.