冲击损坏的多孔碳化硅陶瓷中微裂纹的时间模式

IF 0.8 4区 物理与天体物理 Q4 PHYSICS, APPLIED Technical Physics Letters Pub Date : 2024-08-29 DOI:10.1134/s1063785023170212
I. P. Shcherbakov, A. G. Kadomtsev, A. E. Chmel
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引用次数: 0

摘要

摘要-SiC 陶瓷是一种广泛应用于工程建筑和人体的抗冲击保护材料,本文研究了 SiC 陶瓷在短时间冲击尖角加载下局部损伤发展的时间特征。相应地,采用声发射和电磁发射方法研究了裂纹成核和松弛的统计数据。结果表明,微裂纹成核之间的间隔长度遵循合作现象特有的幂律。相反,冲击引起的裂纹边缘出现的衰减电荷在冲击波通过后湮灭的时间分布是线性的。裂纹弛豫的时间模式允许识别两组新形成的损伤,即晶粒体中的局部微小裂纹和晶粒之间的连接裂纹。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Temporal Pattern of Microcracking in Impact–Damaged Porous SiC Ceramics

Abstract—Temporal characteristics of the localized damage development initiated by a short-time impact pointed loading of SiC ceramics which is widely applied as a protective material against the shock action upon engineering constructions and people were investigated. The statistics of crack nucleation and relaxation was studied with the methods of acoustic emission and electromagnetic emission, correspondingly. It was shown that the length of intervals between microcrack nucleations follows a power law specific to cooperative phenomena. The time distribution of decaying electric charges which appear on impact-induced crack edges and annihilate after the passage of impact wave was, in contrast, linear. The temporal pattern of the crack relaxation permitted identifying two sets of newly formed damages that are the tiny cracks localized in the grain bulk and those that interconnect grains.

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来源期刊
Technical Physics Letters
Technical Physics Letters 物理-物理:应用
CiteScore
1.50
自引率
0.00%
发文量
44
审稿时长
2-4 weeks
期刊介绍: Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.
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