魏布尔竞争风险设备可靠性的有界约束期望最大化

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Device and Materials Reliability Pub Date : 2024-09-10 DOI:10.1109/TDMR.2024.3457728
Uttara Chakraborty;Duane S. Boning;Carl V. Thompson
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引用次数: 0

摘要

电子设备的可靠性评估包括故障机理的识别和寿命的预测。对于威布尔竞争风险模型中的参数估计和失效模式识别,最近开发了一种基于差分进化的全局优化方法,该方法比最著名的局部方法具有优越性。为了设计一种比微分进化更快的方法来解决这一问题,本文提出了一种新的期望最大化算法,该算法能够在优化威布尔分量分布参数的同时处理有界约束。基于差分进化的方法保证每次运行都有一个可行的,但不一定是高质量的解决方案,而本文提出的方法不提供这样的保证。尽管缺乏这种保证,但所提出的方法被视为产生与差异进化高度竞争的质量结果。基于3个真实测试数据集和2个合成数据集的10个测试用例的数值结果表明,在求解质量方面,该方法与差分进化方法具有竞争力,同时平均节省约64%的计算时间。并与标准EM算法和最著名的局部方法L-BFGS-B进行了性能对比分析。数值结果在统计上得到了验证。作为该算法的一个应用,给出了一种通过选择性失效分析来改进模型的新方法。提出的算法有潜力用于涉及不同领域潜在变量的通用似然最大化。
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Bound-Constrained Expectation Maximization for Weibull Competing-Risks Device Reliability
Estimating the reliability of electronic devices involves identification of failure mechanisms and prediction of lifetimes. For parameter estimation and failure mode identification in Weibull competing-risks models, a differential-evolution-based global optimization approach has recently been developed, with the superiority of that approach demonstrated over the best-known local methods for the problem. In an effort to design a method faster than differential evolution for this problem, the present paper develops a new type of expectation maximization (EM) algorithm that is capable of handling bound constraints while optimizing the parameters of the Weibull component distributions. The differential-evolution-based approach guarantees a feasible, but not necessarily high-quality, solution in every run, while the proposed method offers no such guarantee. Despite this lack of guarantee, the proposed method is seen to produce results of a quality highly competitive with differential evolution. Numerical results on ten test cases, based on three real test datasets and two synthetic datasets, show that in terms of solution quality, the proposed method is competitive with differential evolution, while offering an average savings of about 64% in the computation time. Comparative performance analyses with the standard EM algorithm and the best-known local method L-BFGS-B are also provided. The numerical results are statistically validated. A new approach to model improvement via selective failure analysis is demonstrated as an application of the proposed algorithm. The proposed algorithm has the potential to be used for general-purpose likelihood maximization involving latent variables in diverse domains.
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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2024 Index IEEE Transactions on Device and Materials Reliability Vol. 24 Table of Contents Blank Page IEEE Transactions on Device and Materials Reliability Information for Authors TechRxiv: Share Your Preprint Research with the World!
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