Uttara Chakraborty;Duane S. Boning;Carl V. Thompson
{"title":"魏布尔竞争风险设备可靠性的有界约束期望最大化","authors":"Uttara Chakraborty;Duane S. Boning;Carl V. Thompson","doi":"10.1109/TDMR.2024.3457728","DOIUrl":null,"url":null,"abstract":"Estimating the reliability of electronic devices involves identification of failure mechanisms and prediction of lifetimes. For parameter estimation and failure mode identification in Weibull competing-risks models, a differential-evolution-based global optimization approach has recently been developed, with the superiority of that approach demonstrated over the best-known local methods for the problem. In an effort to design a method faster than differential evolution for this problem, the present paper develops a new type of expectation maximization (EM) algorithm that is capable of handling bound constraints while optimizing the parameters of the Weibull component distributions. The differential-evolution-based approach guarantees a feasible, but not necessarily high-quality, solution in every run, while the proposed method offers no such guarantee. Despite this lack of guarantee, the proposed method is seen to produce results of a quality highly competitive with differential evolution. Numerical results on ten test cases, based on three real test datasets and two synthetic datasets, show that in terms of solution quality, the proposed method is competitive with differential evolution, while offering an average savings of about 64% in the computation time. Comparative performance analyses with the standard EM algorithm and the best-known local method L-BFGS-B are also provided. The numerical results are statistically validated. A new approach to model improvement via selective failure analysis is demonstrated as an application of the proposed algorithm. The proposed algorithm has the potential to be used for general-purpose likelihood maximization involving latent variables in diverse domains.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"556-570"},"PeriodicalIF":2.5000,"publicationDate":"2024-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Bound-Constrained Expectation Maximization for Weibull Competing-Risks Device Reliability\",\"authors\":\"Uttara Chakraborty;Duane S. Boning;Carl V. Thompson\",\"doi\":\"10.1109/TDMR.2024.3457728\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Estimating the reliability of electronic devices involves identification of failure mechanisms and prediction of lifetimes. For parameter estimation and failure mode identification in Weibull competing-risks models, a differential-evolution-based global optimization approach has recently been developed, with the superiority of that approach demonstrated over the best-known local methods for the problem. In an effort to design a method faster than differential evolution for this problem, the present paper develops a new type of expectation maximization (EM) algorithm that is capable of handling bound constraints while optimizing the parameters of the Weibull component distributions. The differential-evolution-based approach guarantees a feasible, but not necessarily high-quality, solution in every run, while the proposed method offers no such guarantee. Despite this lack of guarantee, the proposed method is seen to produce results of a quality highly competitive with differential evolution. Numerical results on ten test cases, based on three real test datasets and two synthetic datasets, show that in terms of solution quality, the proposed method is competitive with differential evolution, while offering an average savings of about 64% in the computation time. Comparative performance analyses with the standard EM algorithm and the best-known local method L-BFGS-B are also provided. The numerical results are statistically validated. A new approach to model improvement via selective failure analysis is demonstrated as an application of the proposed algorithm. 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Bound-Constrained Expectation Maximization for Weibull Competing-Risks Device Reliability
Estimating the reliability of electronic devices involves identification of failure mechanisms and prediction of lifetimes. For parameter estimation and failure mode identification in Weibull competing-risks models, a differential-evolution-based global optimization approach has recently been developed, with the superiority of that approach demonstrated over the best-known local methods for the problem. In an effort to design a method faster than differential evolution for this problem, the present paper develops a new type of expectation maximization (EM) algorithm that is capable of handling bound constraints while optimizing the parameters of the Weibull component distributions. The differential-evolution-based approach guarantees a feasible, but not necessarily high-quality, solution in every run, while the proposed method offers no such guarantee. Despite this lack of guarantee, the proposed method is seen to produce results of a quality highly competitive with differential evolution. Numerical results on ten test cases, based on three real test datasets and two synthetic datasets, show that in terms of solution quality, the proposed method is competitive with differential evolution, while offering an average savings of about 64% in the computation time. Comparative performance analyses with the standard EM algorithm and the best-known local method L-BFGS-B are also provided. The numerical results are statistically validated. A new approach to model improvement via selective failure analysis is demonstrated as an application of the proposed algorithm. The proposed algorithm has the potential to be used for general-purpose likelihood maximization involving latent variables in diverse domains.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.