Yang Zhou;Wenjie Wang;Longbin Zhu;Zhengtao Zhu;Risheng Su;Jianan Zheng;Siyuan Xie;Jihong Li;Fanyi Meng;Zhijun Zhou;Keping Wang
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A Second-Order Noise Shaping SAR ADC With Parallel Multiresidual Integrator
This brief proposes a parallel multiresidual (PMR) integrator to enhance the noise-shaping (NS) effect for successive approximation register (SAR) analog-to-digital converter (ADC). The PMR employs passive integrators in parallel to simultaneously integrate the average result of the multiple sequential residual voltages. The proposed PMR technique provides an alternative scheme to enhance the NS rather than increasing the order of the integrator to suppress the instability and power. A prototype 7-bit second-order NS-SAR ADC is designed and simulated in a 130-nm CMOS process. PMR increases the effective number of bits (ENOBs) to 10.6 bit, which enhances the NS effect of 3.6 bit. It achieves a peak signal-to-noise and distortion ratio (SNDR) of 65.84 dB over a bandwidth of 1.3 kHz at the oversampling ratio (OSR) of 16.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.