{"title":"空气烧结铜镍合金电阻器，铝层可防止氧化","authors":"Wen-Hsi Lee, S. W. Chang, Narendra Gharini Puteri","doi":"10.1557/s43579-024-00612-w","DOIUrl":null,"url":null,"abstract":"<p>By applying an aluminum coating to the copper-nickel alloy resistor, we successfully utilized air sintering. At 800 and 850°C, the alloy was sintered within an aluminum layer. This coating of aluminum serves as a protective layer. The copper-nickel was not oxidized as a result. After wet etching, the protective coating of aluminum was removed, leaving alloy resistors with Temperature Coefficient of Resistance (TCR) values of 417.86 ppm/°C. We produced an alloy paste using copper-nickel alloy (7:3) and then used screen printing to create thick-film alloy resistors. Therefore, it is feasible to create copper-nickel alloy resistors by air sintering.</p><h3 data-test=\"abstract-sub-heading\">Graphical abstract</h3>\n","PeriodicalId":19016,"journal":{"name":"MRS Communications","volume":"15 1","pages":""},"PeriodicalIF":1.8000,"publicationDate":"2024-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Air-sintered copper-nickel resistor with aluminum layer for oxidation prevention\",\"authors\":\"Wen-Hsi Lee, S. W. Chang, Narendra Gharini Puteri\",\"doi\":\"10.1557/s43579-024-00612-w\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>By applying an aluminum coating to the copper-nickel alloy resistor, we successfully utilized air sintering. At 800 and 850°C, the alloy was sintered within an aluminum layer. This coating of aluminum serves as a protective layer. The copper-nickel was not oxidized as a result. After wet etching, the protective coating of aluminum was removed, leaving alloy resistors with Temperature Coefficient of Resistance (TCR) values of 417.86 ppm/°C. We produced an alloy paste using copper-nickel alloy (7:3) and then used screen printing to create thick-film alloy resistors. Therefore, it is feasible to create copper-nickel alloy resistors by air sintering.</p><h3 data-test=\\\"abstract-sub-heading\\\">Graphical abstract</h3>\\n\",\"PeriodicalId\":19016,\"journal\":{\"name\":\"MRS Communications\",\"volume\":\"15 1\",\"pages\":\"\"},\"PeriodicalIF\":1.8000,\"publicationDate\":\"2024-08-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"MRS Communications\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1557/s43579-024-00612-w\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"MRS Communications","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1557/s43579-024-00612-w","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Air-sintered copper-nickel resistor with aluminum layer for oxidation prevention
By applying an aluminum coating to the copper-nickel alloy resistor, we successfully utilized air sintering. At 800 and 850°C, the alloy was sintered within an aluminum layer. This coating of aluminum serves as a protective layer. The copper-nickel was not oxidized as a result. After wet etching, the protective coating of aluminum was removed, leaving alloy resistors with Temperature Coefficient of Resistance (TCR) values of 417.86 ppm/°C. We produced an alloy paste using copper-nickel alloy (7:3) and then used screen printing to create thick-film alloy resistors. Therefore, it is feasible to create copper-nickel alloy resistors by air sintering.
期刊介绍：
MRS Communications is a full-color, high-impact journal focused on rapid publication of completed research with broad appeal to the materials community. MRS Communications offers a rapid but rigorous peer-review process and time to publication. Leveraging its access to the far-reaching technical expertise of MRS members and leading materials researchers from around the world, the journal boasts an experienced and highly respected board of principal editors and reviewers.
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