{"title":"具有硅基/硅超晶格通道的多位铁电 HfZrO$_{\\text{2}}$ FinFET 的高温保持稳定性可提高速度和内存窗口","authors":"Yi-Ju Yao;Tsai-Jung Lin;Chen-You Wei;Bo-Xu Chen;Yung-Teng Fang;Heng-Jia Chang;Yu-Min Fu;Guang-Li Luo;Fu-Ju Hou;Yung-Chun Wu","doi":"10.1109/TED.2024.3434772","DOIUrl":null,"url":null,"abstract":"This research investigates multibit ferroelectric FinFET (Fe-FinFET) utilizing SiGe/Si heterostructure superlattice (SL) channel. The SiGe/Si SL multibit Fe-FinFET exhibits a significant memory window (MW) of 1.53 V with SiO\n<sub>2</sub>\n for the interfacial layer (IL) and a rapid switching speed of 100 ns. A comparative analysis with the Si channel device was also conducted. Furthermore, the devices demonstrate the endurance of \n<inline-formula> <tex-math>$10^{4}$ </tex-math></inline-formula>\n cycles, along with a retention duration surpassing \n<inline-formula> <tex-math>$10^{4}$ </tex-math></inline-formula>\n s for each state, maintaining performance integrity over the equivalent of ten years of data retention at room temperature (RT) up to 85 °C. Additionally, basic physical analysis and simulations provide evidence that high mobility channels improve the MW and thermal stability. These results highlight the potential for low operating voltage in high-density 1T nonvolatile memory (NVM) applications.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"71 10","pages":"5975-5979"},"PeriodicalIF":3.2000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High-Temperature Retention Stability of Multibit Ferroelectric HfZrO₂ FinFET With SiGe/Si Superlattice Channel for Enhanced Speed and Memory Window\",\"authors\":\"Yi-Ju Yao;Tsai-Jung Lin;Chen-You Wei;Bo-Xu Chen;Yung-Teng Fang;Heng-Jia Chang;Yu-Min Fu;Guang-Li Luo;Fu-Ju Hou;Yung-Chun Wu\",\"doi\":\"10.1109/TED.2024.3434772\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This research investigates multibit ferroelectric FinFET (Fe-FinFET) utilizing SiGe/Si heterostructure superlattice (SL) channel. The SiGe/Si SL multibit Fe-FinFET exhibits a significant memory window (MW) of 1.53 V with SiO\\n<sub>2</sub>\\n for the interfacial layer (IL) and a rapid switching speed of 100 ns. A comparative analysis with the Si channel device was also conducted. Furthermore, the devices demonstrate the endurance of \\n<inline-formula> <tex-math>$10^{4}$ </tex-math></inline-formula>\\n cycles, along with a retention duration surpassing \\n<inline-formula> <tex-math>$10^{4}$ </tex-math></inline-formula>\\n s for each state, maintaining performance integrity over the equivalent of ten years of data retention at room temperature (RT) up to 85 °C. Additionally, basic physical analysis and simulations provide evidence that high mobility channels improve the MW and thermal stability. These results highlight the potential for low operating voltage in high-density 1T nonvolatile memory (NVM) applications.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":\"71 10\",\"pages\":\"5975-5979\"},\"PeriodicalIF\":3.2000,\"publicationDate\":\"2024-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10679716/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10679716/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
这项研究探讨了利用硅基/硅异质结构超晶格(SL)沟道的多位铁电 FinFET(Fe-FinFET)。在使用二氧化硅作为界面层(IL)的情况下,SiGe/Si SL 多位铁电 FinFET 显示出 1.53 V 的显著记忆窗口(MW)和 100 ns 的快速开关速度。此外,还进行了与硅沟道器件的对比分析。此外,该器件还证明了 10^{4}$ 周期的耐久性,以及每个状态超过 10^{4}$ s 的保持时间,在高达 85 °C 的室温 (RT) 下保持性能完整性相当于 10 年的数据保留时间。此外,基本物理分析和模拟还证明,高迁移率通道可提高 MW 和热稳定性。这些结果凸显了高密度 1T 非易失性存储器 (NVM) 应用中低工作电压的潜力。
High-Temperature Retention Stability of Multibit Ferroelectric HfZrO₂ FinFET With SiGe/Si Superlattice Channel for Enhanced Speed and Memory Window
This research investigates multibit ferroelectric FinFET (Fe-FinFET) utilizing SiGe/Si heterostructure superlattice (SL) channel. The SiGe/Si SL multibit Fe-FinFET exhibits a significant memory window (MW) of 1.53 V with SiO
2
for the interfacial layer (IL) and a rapid switching speed of 100 ns. A comparative analysis with the Si channel device was also conducted. Furthermore, the devices demonstrate the endurance of
$10^{4}$
cycles, along with a retention duration surpassing
$10^{4}$
s for each state, maintaining performance integrity over the equivalent of ten years of data retention at room temperature (RT) up to 85 °C. Additionally, basic physical analysis and simulations provide evidence that high mobility channels improve the MW and thermal stability. These results highlight the potential for low operating voltage in high-density 1T nonvolatile memory (NVM) applications.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.