MOSFET 中相关载流子数量和迁移率波动机制的精细分析

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-09-10 DOI:10.1109/TED.2024.3445310
Bogdan Cretu;Abderrahim Tahiat;Anabela Veloso;Eddy Simoen
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引用次数: 0

摘要

本文证明,在载流子数量波动机制框架内,只有当接入电阻对器件总电阻的贡献可以忽略不计时,输入参考电压噪声才等于平带电压噪声。我们重新研究了相关载流子数和迁移率波动(CNF/CMF)噪声的表达式,并提出了简洁的分析方程。结果表明,如果强反转时的本征迁移率下降不太明显,考虑恒定的本征库仑散射系数或恒定的本征有效库仑散射系数就能得到类似的提取噪声参数。研究还证明,如果器件总电阻中不能忽略接入电阻的影响,则恒定的外在有效库仑散射系数在物理上是不正确的。
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Refined Analysis of the Correlated Carrier Number and Mobility Fluctuations Mechanism in MOSFETs
In this article, it is proven that in the framework of carrier number fluctuation mechanism, the input referred voltage noise is equal to the flat-band voltage noise only if the access resistances give a negligible contribution to the total device resistance. The expression of the correlated carrier number and mobility fluctuations (CNF/CMF) noise is revisited, and compact analytical equations are proposed. It is demonstrated that if the degradation of the intrinsic mobility in strong inversion is not too significant, considering a constant intrinsic Coulomb scattering coefficient or a constant intrinsic effective Coulomb scattering coefficient leads to similar extracted noise parameters. It is also proven that a constant extrinsic effective Coulomb scattering coefficient is physically incorrect if the access resistances impact cannot be neglected in the total device resistance.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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