通过光子捕获孔阵列实现响应增强型 GeSn 光电探测器

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-09-03 DOI:10.1109/TED.2024.3450434
Guoyin Xu;Hui Cong;Rui Pan;Xiaoyu Wang;Lin Shen;Yue Li;Yixin Wang;Hong Lu;Chi Xu;Chunlai Xue
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引用次数: 0

摘要

设计并制造了硅基 GeSn 短波红外(SWIR)光电探测器(PDs),通过精心设计的孔阵列光子捕获结构增强了其在 2000 纳米波长的光响应。光子捕获结构可将光的传播方向从垂直于 PD 表面变为横向,并通过光学共振增强效应提高吸收效率。经测量,表面具有孔阵列的 GeSn PD 的响应率为 79.0 mA/W,在波长为 2000 nm 时增强了 2.3 倍。具有光子捕获结构的高性能 GeSn PD 为高效硅基 SWIR 检测提供了另一种解决方案,作为扩展光通信和单片红外成像焦平面阵列(FPA)的候选器件具有巨大潜力。
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Response-Enhanced GeSn Photodetectors Realized by Photon Trapping Holes Array
Silicon-based GeSn short wave infrared (SWIR) photodetectors (PDs) were designed and fabricated, whose optical response at 2000 nm was enhanced by a carefully designed hole array photon-trapping structure. The photon-trapping structure can change the light propagation direction from being perpendicular to the PD surface to lateral directions, and the absorption efficiency is improved by optical resonance enhancement effect. The responsivity of the GeSn PD with holes array on the surface was measured to be 79.0 mA/W, which has achieved a 2.3 times enhancement at a wavelength of 2000 nm. The high-performance GeSn PDs with photon-trapping structure have offered an alternative solution for high-efficiency silicon-based SWIR detection, manifesting great potential as candidates for extended optical communication and monolithic infrared imaging focal-plane array (FPA).
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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