用于 TFT-LCD 阵列制造中跨工序缺陷分类的新型多模式学习方法

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-08-23 DOI:10.1109/tsm.2024.3448359

Yi Liu, Wei-Te Lee, Hsueh-Ping Lu, Hung-Wen Chen

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A Novel Multi-Modal Learning Approach for Cross-Process Defect Classification in TFT-LCD Array Manufacturing

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来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.

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