利用太赫兹飞行时间断层扫描对微电子共形涂层厚度进行无损测绘的比较研究

{"title":"利用太赫兹飞行时间断层扫描对微电子共形涂层厚度进行无损测绘的比较研究","authors":"Min Zhai, Serena Calvelli, Haolian Shi, Marco Ricci, S. Laureti, Prabjit Singh, Haley Fu, Alexandre Locquet, D. S. Citrin","doi":"10.1109/tsm.2024.3447892","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"21 1","pages":""},"PeriodicalIF":2.3000,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography\",\"authors\":\"Min Zhai, Serena Calvelli, Haolian Shi, Marco Ricci, S. Laureti, Prabjit Singh, Haley Fu, Alexandre Locquet, D. S. Citrin\",\"doi\":\"10.1109/tsm.2024.3447892\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":451,\"journal\":{\"name\":\"IEEE Transactions on Semiconductor Manufacturing\",\"volume\":\"21 1\",\"pages\":\"\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-08-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Semiconductor Manufacturing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/tsm.2024.3447892\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/tsm.2024.3447892","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}