烧结大豆粉的可持续电介质:结构、热和压电特性

IF 2.9 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-09-02 DOI:10.1109/TDEI.2024.3452951
Hema Dinesh Barnana;Charlie O’Mahony;Krittish Roy;Ehtsham Ul Haq;Syed A. M. Tofail
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引用次数: 0

摘要

在这项研究中,我们采用 "冷烧结 "方法对大豆粉末进行烧结和结晶,以开发一种具有高频通信应用潜力的生物驻极体。我们使用 X 射线衍射 (XRD)、傅立叶变换红外光谱 (FTIR) 和热重分析 (TGA) 研究了大豆粉末中甘氨酸球蛋白的结构解体和相变与烧结参数的关系。压电响应力显微镜(PFM)显示,冷压大豆和烧结大豆中的一些局部区域分别具有微弱(0.7 pm/V)到合理(2.7 pm/V)的平面外压电响应。然而,烧结生物电极并未显示出任何宏观压电性。
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Sustainable Dielectrics From Sintered Soyabean Powders: Structure, Thermal, and Piezoelectric Properties
In this work, we approached sintering and crystallization of soyabean powders with a “cold sintering” approach to develop a bioelectret for potential high-frequency communication applications. Structural disintegration and phase evolution of glycinin globulin proteins present in soyabean powders in relation to sintering parameters were investigated using X ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, and thermogravimetry analysis (TGA). Piezoresponse force microscopy (PFM) showed some localized area with weak (0.7 pm/V) to reasonable (2.7 pm/V) out of plane piezoresponse in cold pressed and sintered soyabeans, respectively. Sintered bioelectrets did not show any macroscopic piezoelectricity, however.
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来源期刊
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程:电子与电气
CiteScore
6.00
自引率
22.60%
发文量
309
审稿时长
5.2 months
期刊介绍: Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.
期刊最新文献
2024 Index IEEE Transactions on Dielectrics and Electrical Insulation Vol. 31 Table of Contents Editorial Condition Monitoring and Diagnostics of Electrical Insulation IEEE Transactions on Dielectrics and Electrical Insulation Information for Authors IEEE Transactions on Dielectrics and Electrical Insulation Publication Information
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