Keda Chen, Jingrui Wang, Chengyi Qin, Jian Wang, Jikui Liu, Shumin Zhang, Liang Zou, Li Zhang
{"title":"基于实验和随机分布模型的环氧树脂/微胶囊自愈合复合材料的电导机制分析","authors":"Keda Chen, Jingrui Wang, Chengyi Qin, Jian Wang, Jikui Liu, Shumin Zhang, Liang Zou, Li Zhang","doi":"10.1109/tdei.2024.3447625","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrical conduction mechanism analysis of epoxy resin/microcapsule self-healing composites based on experiment and random distribution model\",\"authors\":\"Keda Chen, Jingrui Wang, Chengyi Qin, Jian Wang, Jikui Liu, Shumin Zhang, Liang Zou, Li Zhang\",\"doi\":\"10.1109/tdei.2024.3447625\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":13247,\"journal\":{\"name\":\"IEEE Transactions on Dielectrics and Electrical Insulation\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-08-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Dielectrics and Electrical Insulation\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/tdei.2024.3447625\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Dielectrics and Electrical Insulation","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/tdei.2024.3447625","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
期刊介绍:
Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.