Yasuaki Nakamura, Madoka Nishikawa, Simon J. Greaves, Yasushi Kanai, Yoshihiro Okamoto
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A study on HAMR read/write channel models for double layer magnetic recording
Three-dimensional (3D) magnetic recording with multiple recording layers has garnered considerable attention as a next-generation magnetic recording method that uses dual conventional recording layers and a magnetoresistive (MR) head for reading. In this work, to examine signal processing methods for the 3D magnetic read/write (R/W) channel using heat-assisted magnetic recording (HAMR), we have constructed a HAMR R/W channel using a granular media model. Our 3D HAMR R/W channel model, specialized for signal processing development, can account for the Curie temperatures of the recording layers and the temperature distribution of the heat source.
期刊介绍：
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS
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