基于金属弹性体复合材料的高拉伸电路

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-08-23 DOI:10.1109/LED.2024.3449153
Fankai Kong;Hu Tang;Peng Liu;Xiao Liu;Jiwei Zhao;Junjian Li;Jue Peng
{"title":"基于金属弹性体复合材料的高拉伸电路","authors":"Fankai Kong;Hu Tang;Peng Liu;Xiao Liu;Jiwei Zhao;Junjian Li;Jue Peng","doi":"10.1109/LED.2024.3449153","DOIUrl":null,"url":null,"abstract":"We develop a highly stretchable circuit by utilizing serpentine interconnects made of high-elasticity Cu-Be alloy. An elastic equivalent model of serpentine interconnect is used to optimize the geometric parameters, thereby enhancing its mechanical compatibility with the soft substrate. Furthermore, we propose a rapid fabrication method of highly stretchable circuits through the laser cutting and film transfer techniques. The results indicate that the elastic strain limit of the Cu-Be alloy serpentine interconnect is 4 times that of the Cu interconnect. The Cu-Be alloy serpentine circuit with optimized geometric parameters exhibits an excellent resistance stability under 1000 cycles of tensile testing at 90% strain without local delamination or failure. The light emitting diode (LED) array demonstrates an ultrahigh tensile strain limit of up to 200%. The proposed method can provide a novel and promising way for the fabrication of highly stretchable circuits for future wearable electronic devices.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"45 10","pages":"1937-1940"},"PeriodicalIF":4.1000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Highly Stretchable Circuit Based on Metal-Elastomer Composite\",\"authors\":\"Fankai Kong;Hu Tang;Peng Liu;Xiao Liu;Jiwei Zhao;Junjian Li;Jue Peng\",\"doi\":\"10.1109/LED.2024.3449153\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We develop a highly stretchable circuit by utilizing serpentine interconnects made of high-elasticity Cu-Be alloy. An elastic equivalent model of serpentine interconnect is used to optimize the geometric parameters, thereby enhancing its mechanical compatibility with the soft substrate. Furthermore, we propose a rapid fabrication method of highly stretchable circuits through the laser cutting and film transfer techniques. The results indicate that the elastic strain limit of the Cu-Be alloy serpentine interconnect is 4 times that of the Cu interconnect. The Cu-Be alloy serpentine circuit with optimized geometric parameters exhibits an excellent resistance stability under 1000 cycles of tensile testing at 90% strain without local delamination or failure. The light emitting diode (LED) array demonstrates an ultrahigh tensile strain limit of up to 200%. The proposed method can provide a novel and promising way for the fabrication of highly stretchable circuits for future wearable electronic devices.\",\"PeriodicalId\":13198,\"journal\":{\"name\":\"IEEE Electron Device Letters\",\"volume\":\"45 10\",\"pages\":\"1937-1940\"},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2024-08-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Electron Device Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10644053/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10644053/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

我们利用由高弹性铜铍合金制成的蛇形互连器件,开发出了一种高度可拉伸的电路。我们利用蛇形互连的弹性等效模型来优化几何参数,从而提高其与软基板的机械兼容性。此外,我们还提出了一种通过激光切割和薄膜转移技术快速制造高拉伸电路的方法。结果表明,铜铍合金蛇形互连的弹性应变极限是铜互连的 4 倍。具有优化几何参数的铜铍合金蛇形电路在 90% 应变的 1000 次拉伸测试中表现出极佳的电阻稳定性,不会出现局部分层或失效。发光二极管 (LED) 阵列显示出高达 200% 的超高拉伸应变极限。所提出的方法为未来可穿戴电子设备高拉伸电路的制造提供了一种新颖而有前景的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A Highly Stretchable Circuit Based on Metal-Elastomer Composite
We develop a highly stretchable circuit by utilizing serpentine interconnects made of high-elasticity Cu-Be alloy. An elastic equivalent model of serpentine interconnect is used to optimize the geometric parameters, thereby enhancing its mechanical compatibility with the soft substrate. Furthermore, we propose a rapid fabrication method of highly stretchable circuits through the laser cutting and film transfer techniques. The results indicate that the elastic strain limit of the Cu-Be alloy serpentine interconnect is 4 times that of the Cu interconnect. The Cu-Be alloy serpentine circuit with optimized geometric parameters exhibits an excellent resistance stability under 1000 cycles of tensile testing at 90% strain without local delamination or failure. The light emitting diode (LED) array demonstrates an ultrahigh tensile strain limit of up to 200%. The proposed method can provide a novel and promising way for the fabrication of highly stretchable circuits for future wearable electronic devices.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
期刊最新文献
Table of Contents Front Cover IEEE Electron Device Letters Publication Information IEEE Electron Device Letters Information for Authors Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1