Ga2O3 的蚀刻:设备制造的重要工艺

IF 3.1 3区 物理与天体物理 Q2 PHYSICS, APPLIED Journal of Physics D: Applied Physics Pub Date : 2024-09-11 DOI:10.1088/1361-6463/ad773d
Zhaoying Xi, Zeng Liu, Junpeng Fang, Ang Bian, Shaohui Zhang, Jia-Han Zhang, Lei Li, Yufeng Guo and Weihua Tang
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引用次数: 0

摘要

蚀刻在电子和光电器件的加工制造中起着关键作用。对于超宽带隙半导体氧化镓(Ga2O3)而言,其蚀刻研究和演化机制仍处于早期阶段,需要投入更多的研究精力。在这篇综述中,我们对 Ga2O3 的刻蚀进行了总结,包括干法(等离子体)刻蚀、湿法化学刻蚀和光电化学刻蚀,并讨论了刻蚀结果、存在的问题和可行的解决方案,以期为进一步发展 Ga2O3 刻蚀和基于 Ga2O3 的电子和光电器件提供指导和建议。
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Etching of Ga2O3: an important process for device manufacturing
Etching plays a key role in processing and manufacturing electronic and optoelectronic devices. For ultra-wide bandgap semiconductor gallium oxide (Ga2O3), its etching investigations and evolution mechanism are still at the earlier stage, and some more research gumption should be invested. In this review, we make a summary on the etching of Ga2O3, including dry (plasma) etching, wet chemical etching, and photoelectrochemical etching, and discuss the etching results, existing problems, and feasible solutions, in order to provide guidance and advises for furtherly developing the Ga2O3 etching and Ga2O3-based electronic and optoelectronic devices.
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来源期刊
Journal of Physics D: Applied Physics
Journal of Physics D: Applied Physics 物理-物理:应用
CiteScore
6.80
自引率
8.80%
发文量
835
审稿时长
2.1 months
期刊介绍: This journal is concerned with all aspects of applied physics research, from biophysics, magnetism, plasmas and semiconductors to the structure and properties of matter.
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