{"title":"用于封装-封装技术的 SAC305/SnPb 微混合焊点的电迁移失效行为研究：实验与模拟","authors":"","doi":"10.1016/j.matlet.2024.137394","DOIUrl":null,"url":null,"abstract":"<div><p>The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.</p></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":null,"pages":null},"PeriodicalIF":2.7000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation\",\"authors\":\"\",\"doi\":\"10.1016/j.matlet.2024.137394\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.</p></div>\",\"PeriodicalId\":384,\"journal\":{\"name\":\"Materials Letters\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2024-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0167577X24015349\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X24015349","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation
The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.
期刊介绍：
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
• Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
• Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
• Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
• Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
• Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
• Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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