{"title":"晶界效应对强度-导电率关系的定量模型","authors":"","doi":"10.1016/j.actamat.2024.120390","DOIUrl":null,"url":null,"abstract":"<div><p>Fine-long shaped grains have been proved to be an efficient design approach to overcome the traditional trade-off relation between strength and electrical conductivity (EC) of metal wires. However, quantitative models linking grain shape parameters to both strength and EC remain scarce, limiting the precise optimization of material properties. In this study, grain boundaries (GBs) were classified into parallel or perpendicular ones to establish the quantitative models. Accordingly, a novel model for calculating the EC of fine-long shaped grains was proposed by first parallel-connecting the parallel GBs with the matrix, then series-connecting them with the vertical GBs. The EC calculated using this new model shows a small error band of only 0.5 %, indicating an excellent accuracy of EC calculation. Besides, a quantitative model for calculating the strength based on grain width was also developed. Consequently, the general effects of grain shape parameters including grain width, grain length, grain volume and grain aspect ratio on the strength and EC were quantitatively revealed. This work does not only advance the principle for achieving high strength and high EC through fine-long shaped grains from a qualitative concept to a quantitative framework but also offers valuable insights for the quantitative analysis of GB effects on strength and EC in other materials.</p></div>","PeriodicalId":238,"journal":{"name":"Acta Materialia","volume":null,"pages":null},"PeriodicalIF":8.3000,"publicationDate":"2024-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Quantitative model for grain boundary effects on strength-electrical conductivity relation\",\"authors\":\"\",\"doi\":\"10.1016/j.actamat.2024.120390\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Fine-long shaped grains have been proved to be an efficient design approach to overcome the traditional trade-off relation between strength and electrical conductivity (EC) of metal wires. However, quantitative models linking grain shape parameters to both strength and EC remain scarce, limiting the precise optimization of material properties. In this study, grain boundaries (GBs) were classified into parallel or perpendicular ones to establish the quantitative models. Accordingly, a novel model for calculating the EC of fine-long shaped grains was proposed by first parallel-connecting the parallel GBs with the matrix, then series-connecting them with the vertical GBs. The EC calculated using this new model shows a small error band of only 0.5 %, indicating an excellent accuracy of EC calculation. Besides, a quantitative model for calculating the strength based on grain width was also developed. Consequently, the general effects of grain shape parameters including grain width, grain length, grain volume and grain aspect ratio on the strength and EC were quantitatively revealed. This work does not only advance the principle for achieving high strength and high EC through fine-long shaped grains from a qualitative concept to a quantitative framework but also offers valuable insights for the quantitative analysis of GB effects on strength and EC in other materials.</p></div>\",\"PeriodicalId\":238,\"journal\":{\"name\":\"Acta Materialia\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":8.3000,\"publicationDate\":\"2024-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Acta Materialia\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1359645424007407\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Materialia","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1359645424007407","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Quantitative model for grain boundary effects on strength-electrical conductivity relation
Fine-long shaped grains have been proved to be an efficient design approach to overcome the traditional trade-off relation between strength and electrical conductivity (EC) of metal wires. However, quantitative models linking grain shape parameters to both strength and EC remain scarce, limiting the precise optimization of material properties. In this study, grain boundaries (GBs) were classified into parallel or perpendicular ones to establish the quantitative models. Accordingly, a novel model for calculating the EC of fine-long shaped grains was proposed by first parallel-connecting the parallel GBs with the matrix, then series-connecting them with the vertical GBs. The EC calculated using this new model shows a small error band of only 0.5 %, indicating an excellent accuracy of EC calculation. Besides, a quantitative model for calculating the strength based on grain width was also developed. Consequently, the general effects of grain shape parameters including grain width, grain length, grain volume and grain aspect ratio on the strength and EC were quantitatively revealed. This work does not only advance the principle for achieving high strength and high EC through fine-long shaped grains from a qualitative concept to a quantitative framework but also offers valuable insights for the quantitative analysis of GB effects on strength and EC in other materials.
期刊介绍:
Acta Materialia serves as a platform for publishing full-length, original papers and commissioned overviews that contribute to a profound understanding of the correlation between the processing, structure, and properties of inorganic materials. The journal seeks papers with high impact potential or those that significantly propel the field forward. The scope includes the atomic and molecular arrangements, chemical and electronic structures, and microstructure of materials, focusing on their mechanical or functional behavior across all length scales, including nanostructures.