{"title":"使用 PowerVia 的英特尔 4 2048×60m4 SRAM 设计与环绕阵列供电方案","authors":"Daeyeon Kim;Yusung Kim;Gyusung Park;Anandkumar Mahadevan Pillai;Kunal Bannore;Tri Doan;Muktadir Rahman;Gwanghyeon Baek;Xiaofei Wang;Zheng Guo;Eric Karl","doi":"10.1109/LSSC.2024.3443757","DOIUrl":null,"url":null,"abstract":"A \n<inline-formula> <tex-math>$2048\\times 60$ </tex-math></inline-formula>\n m4 SRAM design in Intel 4 using PowerVia is presented. Instead of integrating PowerVia directly into bitcell, an around-the-array power-delivery scheme is introduced to limit the area increase of an SRAM bitcell array, while utilizing the benefits of PowerVias in logic peripheral circuits. The measured test chip demonstrates an improved or comparable \n<inline-formula> <tex-math>$\\rm V_{MIN}$ </tex-math></inline-formula>\n and performance compared to similar nonPowerVia designs. An 8.3-Mb macro comprising of HCC bitcell-based \n<inline-formula> <tex-math>$2048\\times 60$ </tex-math></inline-formula>\n m4 instance is 2% smaller than similar nonPowerVia design and shows a clean voltage-frequency Shmoo.","PeriodicalId":13032,"journal":{"name":"IEEE Solid-State Circuits Letters","volume":"7 ","pages":"243-246"},"PeriodicalIF":2.2000,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A 2048×60m4 SRAM Design in Intel 4 With Around-the-Array Power Delivery Scheme Using PowerVia\",\"authors\":\"Daeyeon Kim;Yusung Kim;Gyusung Park;Anandkumar Mahadevan Pillai;Kunal Bannore;Tri Doan;Muktadir Rahman;Gwanghyeon Baek;Xiaofei Wang;Zheng Guo;Eric Karl\",\"doi\":\"10.1109/LSSC.2024.3443757\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A \\n<inline-formula> <tex-math>$2048\\\\times 60$ </tex-math></inline-formula>\\n m4 SRAM design in Intel 4 using PowerVia is presented. Instead of integrating PowerVia directly into bitcell, an around-the-array power-delivery scheme is introduced to limit the area increase of an SRAM bitcell array, while utilizing the benefits of PowerVias in logic peripheral circuits. The measured test chip demonstrates an improved or comparable \\n<inline-formula> <tex-math>$\\\\rm V_{MIN}$ </tex-math></inline-formula>\\n and performance compared to similar nonPowerVia designs. An 8.3-Mb macro comprising of HCC bitcell-based \\n<inline-formula> <tex-math>$2048\\\\times 60$ </tex-math></inline-formula>\\n m4 instance is 2% smaller than similar nonPowerVia design and shows a clean voltage-frequency Shmoo.\",\"PeriodicalId\":13032,\"journal\":{\"name\":\"IEEE Solid-State Circuits Letters\",\"volume\":\"7 \",\"pages\":\"243-246\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-08-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Solid-State Circuits Letters\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10636777/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Solid-State Circuits Letters","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10636777/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
A 2048×60m4 SRAM Design in Intel 4 With Around-the-Array Power Delivery Scheme Using PowerVia
A
$2048\times 60$
m4 SRAM design in Intel 4 using PowerVia is presented. Instead of integrating PowerVia directly into bitcell, an around-the-array power-delivery scheme is introduced to limit the area increase of an SRAM bitcell array, while utilizing the benefits of PowerVias in logic peripheral circuits. The measured test chip demonstrates an improved or comparable
$\rm V_{MIN}$
and performance compared to similar nonPowerVia designs. An 8.3-Mb macro comprising of HCC bitcell-based
$2048\times 60$
m4 instance is 2% smaller than similar nonPowerVia design and shows a clean voltage-frequency Shmoo.