{"title":"界面热阻对铜-B/金刚石复合材料热导率影响的数值研究","authors":"","doi":"10.1016/j.vacuum.2024.113654","DOIUrl":null,"url":null,"abstract":"<div><p>Cu/diamond composite is a promising thermal management material for heat dissipation of high-power electronic devices. Heat transfer models for a Cu-B/diamond composite with varying boron contents added in the Cu matrix were constructed using the finite element (FE) method, based on the results from transmission electron microscopy (TEM) characterization. The heat transfer behavior of the Cu/diamond composites was then investigated. The predicted effective thermal conductivities were compared to experimental values, using both analytical model calculation and FE simulation. The FE simulation effectively illustrates the dependence of thermal conductivity on interface structure evolution of the composite. The heat transfer behavior of the Cu-B/diamond composites varies as the boron content increases. In the Cu-0.3 wt%B/diamond composite, most of the heat flow is concentrated and transferred along the diamond particles. In the Cu-1.0 wt%B/diamond composite, the heat flux distribution and flow direction are similar to those in the Cu-0.3 wt%B/diamond composite, but the heat flux is substantially lower. The heat transfer behavior is closely related to the interactions between the two phases in the composite and is intensively influenced by the evolution of interfacial carbide morphology. The FE simulation provides a more accurate prediction of effective thermal conductivity compared to the analytical model calculation, as it considers the reasonable interactions between the two phases relating to the actual interfacial structure. The findings provide a fundamental basis for optimizing the interfacial structure of Cu/diamond composites and further improving their thermal conductivity.</p></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2024-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites\",\"authors\":\"\",\"doi\":\"10.1016/j.vacuum.2024.113654\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Cu/diamond composite is a promising thermal management material for heat dissipation of high-power electronic devices. Heat transfer models for a Cu-B/diamond composite with varying boron contents added in the Cu matrix were constructed using the finite element (FE) method, based on the results from transmission electron microscopy (TEM) characterization. The heat transfer behavior of the Cu/diamond composites was then investigated. The predicted effective thermal conductivities were compared to experimental values, using both analytical model calculation and FE simulation. The FE simulation effectively illustrates the dependence of thermal conductivity on interface structure evolution of the composite. The heat transfer behavior of the Cu-B/diamond composites varies as the boron content increases. In the Cu-0.3 wt%B/diamond composite, most of the heat flow is concentrated and transferred along the diamond particles. In the Cu-1.0 wt%B/diamond composite, the heat flux distribution and flow direction are similar to those in the Cu-0.3 wt%B/diamond composite, but the heat flux is substantially lower. The heat transfer behavior is closely related to the interactions between the two phases in the composite and is intensively influenced by the evolution of interfacial carbide morphology. The FE simulation provides a more accurate prediction of effective thermal conductivity compared to the analytical model calculation, as it considers the reasonable interactions between the two phases relating to the actual interfacial structure. The findings provide a fundamental basis for optimizing the interfacial structure of Cu/diamond composites and further improving their thermal conductivity.</p></div>\",\"PeriodicalId\":23559,\"journal\":{\"name\":\"Vacuum\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.8000,\"publicationDate\":\"2024-09-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Vacuum\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0042207X24007000\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X24007000","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites
Cu/diamond composite is a promising thermal management material for heat dissipation of high-power electronic devices. Heat transfer models for a Cu-B/diamond composite with varying boron contents added in the Cu matrix were constructed using the finite element (FE) method, based on the results from transmission electron microscopy (TEM) characterization. The heat transfer behavior of the Cu/diamond composites was then investigated. The predicted effective thermal conductivities were compared to experimental values, using both analytical model calculation and FE simulation. The FE simulation effectively illustrates the dependence of thermal conductivity on interface structure evolution of the composite. The heat transfer behavior of the Cu-B/diamond composites varies as the boron content increases. In the Cu-0.3 wt%B/diamond composite, most of the heat flow is concentrated and transferred along the diamond particles. In the Cu-1.0 wt%B/diamond composite, the heat flux distribution and flow direction are similar to those in the Cu-0.3 wt%B/diamond composite, but the heat flux is substantially lower. The heat transfer behavior is closely related to the interactions between the two phases in the composite and is intensively influenced by the evolution of interfacial carbide morphology. The FE simulation provides a more accurate prediction of effective thermal conductivity compared to the analytical model calculation, as it considers the reasonable interactions between the two phases relating to the actual interfacial structure. The findings provide a fundamental basis for optimizing the interfacial structure of Cu/diamond composites and further improving their thermal conductivity.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.