多层厚不对称层压板工艺诱导变形的堆叠顺序优化策略

IF 4.8 2区 材料科学 Q2 MATERIALS SCIENCE, COMPOSITES Polymer Composites Pub Date : 2024-09-16 DOI:10.1002/pc.29048
Hongli Jia, Yingdan Zhu, Chun Yan, Gang Chen, Dong Liu
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引用次数: 0

摘要

复合材料层压板在加工过程中产生的变形对装配精度提出了挑战,并可能导致部件的使用寿命缩短。然而,在精确固化过程模拟的基础上,通过不同的优化策略可以明显缓解这种情况。本研究提出了一种堆叠顺序优化策略,并将其应用于多层厚不对称层压板。利用三维坐标测量机对变形层压板的形状进行了实验研究。首先通过比较模型预测和实验过程引起的变形,验证了板材的热化学机械行为。然后,针对堆叠顺序与工艺诱导变形之间的直接关系,提出了通过回归模型实现的非线性控制公式。最后,通过求解控制公式得出所需的解决方案。通过比较优化前后的平均变形量,可以发现变形量明显减小,尤其是当未优化的变形量较大时。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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A stacking sequence optimization strategy for process-induced deformation of multi-layer thick asymmetric laminates
The occurrence of process-induced deformations of composites laminates is challenging for assembly accuracy and may lead to a service life reduction of parts. However, it can be obviously mitigated through different optimization strategies on the basis of the accurate curing process simulation. In this study, a stacking sequence optimization strategy is proposed and applied to multi-layer thick asymmetric laminates. The shapes of deformed laminate plates are experimentally investigated in virtue of the three-dimensional coordinate measuring machine. The thermo-chemical–mechanical behaviors of plates are first verified through the comparisons of model predicted and experimental process-induced deformations. Then the nonlinear control formula achieved through the regression model is proposed for the direct relationship between stacking sequences and process-induced deformations. Finally, the required solutions are generated by solving the control formula. With the comparisons between the average deformations before and after optimizations, it is found that the magnitudes of deformations are significantly reduced, especially when the unoptimizated deformations are large.
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来源期刊
Polymer Composites
Polymer Composites 工程技术-材料科学:复合
CiteScore
7.50
自引率
32.70%
发文量
673
审稿时长
3.1 months
期刊介绍: Polymer Composites is the engineering and scientific journal serving the fields of reinforced plastics and polymer composites including research, production, processing, and applications. PC brings you the details of developments in this rapidly expanding area of technology long before they are commercial realities.
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