Preparation and study on electrical/thermal properties of epoxy/polyacrylate rubber composite dielectric

With the development of power systems and electronic devices, epoxy resin (EP) is facing increasingly severe operating environments, and its performance may not meet expectations. In order to broaden the application of EP, the DE/EP composite films were prepared with EP as matrix, polyacrylic rubber dielectric elastomer (DE) as reinforcement materials. The structure of DE/EP composite films was characterized by XRD, SEM, and other methods, and the electrical and thermal properties of the materials were tested and studied. The study found that with appropriate dissolution and stirring treatment, DE can be evenly dispersed in the EP matrix, and the introduction of DE does not significantly affect the structure of the EP molecular chain, also found the introduction of DE improve the electrical and thermal properties of EP. The breakdown strength of the 4% DE/EP composite film surpasses that of the pure EP film by 15.58%. Additionally, the thermal conductivity of the 8% DE/EP composite film is elevated by 41.6% compared to the pure EP film, while its dielectric constant is also enhanced by 8.2%. This work may provide a theoretical basis for studying the application of EP modified system in electrical engineering, integrated circuit packaging and other fields.