晶圆级交换系统架构探索

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-09-17 DOI:10.1109/TVLSI.2024.3455332
Zhiquan Wan;Zhipeng Cao;Shunbin Li;Peijie Li;Qingwen Deng;Weihao Wang;Kun Zhang;Guandong Liu;Ruyun Zhang;Qinrang Liu
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引用次数: 0

摘要

随着摩尔定律和登纳德缩放的终结,将多个预先测试的已知良好芯片(KGDs)集成在晶圆级中间层上的晶圆级系统或处理器是进一步提高基于芯片的系统性能的新方法。本文探讨了在几种物理约束条件下,晶圆级交换系统的NoW架构。提出了一种基于软件的拓扑属性重定义方法。基于二维网格状物理拓扑,实现了具有8.96 tb /s(896个端口$\乘以10$ Gb/s/端口)交换带宽的五层蝶形胖树(BFT)逻辑拓扑。研究表明,在不同的流量分布下,基于广度优先搜索(BFS)的流量均衡路由算法与类bft拓扑相比,减少了55.6%的跳数,41.4%的传输延迟,提高了24.2%的吞吐量。这种类似bft的晶圆级交换系统适用于高性能计算和数据中心。此外,数值分析表明,与典型的单芯片封装相比,晶圆级封装可以提供显着的功耗效率和延迟优势,这主要得益于短距离IO要求。值得注意的是,所提出的晶圆级开关系统兼容具有先进工艺技术的高开关容量芯片,可以进一步提高系统性能。最后,我们提出了异构晶片系统的物理实现。
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Architectural Exploration for Waferscale Switching System
With the end of Moore’s law and Dennard scaling, waferscale systems or processors that integrate multiple pre-tested known good dies (KGDs) on a waferscale-interposer are new approaches to further improve the chiplet-based system’s performance. This article explores the network on wafer (NoW) architecture of waferscale switching system under several physical constraints. A software-based approach is proposed to redefine the topological property. A five-level butterfly fat-tree (BFT)-like logical topology with 8.96-Tb/s (896 ports $\times 10$ Gb/s/port) switching bandwidth is achieved based on 2-D-mesh-like physical topology. We show that the proposed BFT-like topology with breadth-first-search (BFS) based traffic balanced routing algorithm reduces 55.6% hops, 41.4% transmission delay, and improves 24.2% throughput compared to 2-D-mesh-like topology under different traffic distributions. This BFT-like waferscale switching system is suitable for high-performance computing and data centers. In addition, the numerical analysis shows that the waferscale package can provide significant power efficiency and latency advantages compared to the typical single-chip package, which mainly benefits from the short-reach IO requirements. Note that the proposed waferscale switching system is compatible with high-switch-capacity dies with advanced process technology, which can further improve system performance. Finally, we present the physical implementations for the waferscale system with heterogeneous dies.
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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