钽/镍双夹层对高强度钛合金和钢复合板微观结构和性能的影响

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2024-09-14 DOI:10.1016/j.vacuum.2024.113569
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引用次数: 0

摘要

通过添加钽/镍双夹层并在 950 °C下轧制,利用真空电子束焊接对称毛坯套筒,实现了超高强度钛合金(Ti-6Al-4V,TC4)和 30CrNiMoNb 钢(6211)的结合。为了揭示冶金结合机制和界面结构,使用了扫描电镜、XRD 和压缩剪切性能测试。结果表明,TC4/6211 界面存在薄膜状脆性 TiC、TiFe 和 TiFe2 化合物,导致沿基体相界面的界面失配和脆性断裂风险增加,经测试,平均界面结合强度为 323 MPa。利用选区电子衍射 (SAED) 分析了 Ta/Ni 双层界面结合的强化机制,发现 Ta-Ni 扩散区由 Ni3Ta 和 Ni2Ta 组成。Ta/Ni双层界面的加入阻止了Ti和Fe原子聚集形成Ti-Fe化合物。Ni3Ta 和 Ni2Ta 的可锻金属间化合物有效地协调了变形,使平均界面结合强度达到 469 兆帕,比不添加 Ta/Ni 双夹层的复合板高出 45.2%。
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Effect of Ta/Ni dual-interlayer on the microstructure and properties of high strength titanium alloy and steel composite plate
The combination of ultra-high-strength Ti-6Al-4V (TC4) titanium alloy and 30CrNiMoNb (6211) steel was achieved by adding Ta/Ni dual-interlayer and rolling at 950 °C through welding a symmetrical blank sleeve with a vacuum electron beam. In order to unveil the metallurgical bonding mechanism and the interfacial structure, SEM, XRD, and compression-shear performance tests were used. The results revealed the presence of thin-film brittle TiC, TiFe, and TiFe2 compounds at the TC4/6211 interface, resulting in an increased risk of interface mismatch and brittle fracture along the matrix phase interface, and the average interfacial bonding strength was tested at 323 MPa.
In contrast, the TC4-Ta interface and the 6211-Ni interface in the TC4/Ta/Ni/6211 composite plate displayed good solid solution formation. The strengthening mechanism of the Ta/Ni dual-interlayer interfacial bonding was analyzed using selected area electron diffraction (SAED), revealing that the Ta-Ni diffusion region consisted of Ni3Ta and Ni2Ta. The addition of the Ta/Ni dual-interlayer prevented the aggregation of Ti and Fe atoms to form Ti-Fe compounds. The malleable intermetallic compounds of Ni3Ta and Ni2Ta effectively coordinated deformation, leading to an average interfacial bonding strength of 469 MPa, which was 45.2 % higher than the composite plate without Ta/Ni dual-interlayer.
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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