{"title":"钽/镍双夹层对高强度钛合金和钢复合板微观结构和性能的影响","authors":"","doi":"10.1016/j.vacuum.2024.113569","DOIUrl":null,"url":null,"abstract":"<div><div>The combination of ultra-high-strength Ti-6Al-4V (TC4) titanium alloy and 30CrNiMoNb (6211) steel was achieved by adding Ta/Ni dual-interlayer and rolling at 950 °C through welding a symmetrical blank sleeve with a vacuum electron beam. In order to unveil the metallurgical bonding mechanism and the interfacial structure, SEM, XRD, and compression-shear performance tests were used. The results revealed the presence of thin-film brittle TiC, TiFe, and TiFe<sub>2</sub> compounds at the TC4/6211 interface, resulting in an increased risk of interface mismatch and brittle fracture along the matrix phase interface, and the average interfacial bonding strength was tested at 323 MPa.</div><div>In contrast, the TC4-Ta interface and the 6211-Ni interface in the TC4/Ta/Ni/6211 composite plate displayed good solid solution formation. The strengthening mechanism of the Ta/Ni dual-interlayer interfacial bonding was analyzed using selected area electron diffraction (SAED), revealing that the Ta-Ni diffusion region consisted of Ni<sub>3</sub>Ta and Ni<sub>2</sub>Ta. The addition of the Ta/Ni dual-interlayer prevented the aggregation of Ti and Fe atoms to form Ti-Fe compounds. The malleable intermetallic compounds of Ni<sub>3</sub>Ta and Ni<sub>2</sub>Ta effectively coordinated deformation, leading to an average interfacial bonding strength of 469 MPa, which was 45.2 % higher than the composite plate without Ta/Ni dual-interlayer.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2024-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of Ta/Ni dual-interlayer on the microstructure and properties of high strength titanium alloy and steel composite plate\",\"authors\":\"\",\"doi\":\"10.1016/j.vacuum.2024.113569\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The combination of ultra-high-strength Ti-6Al-4V (TC4) titanium alloy and 30CrNiMoNb (6211) steel was achieved by adding Ta/Ni dual-interlayer and rolling at 950 °C through welding a symmetrical blank sleeve with a vacuum electron beam. In order to unveil the metallurgical bonding mechanism and the interfacial structure, SEM, XRD, and compression-shear performance tests were used. The results revealed the presence of thin-film brittle TiC, TiFe, and TiFe<sub>2</sub> compounds at the TC4/6211 interface, resulting in an increased risk of interface mismatch and brittle fracture along the matrix phase interface, and the average interfacial bonding strength was tested at 323 MPa.</div><div>In contrast, the TC4-Ta interface and the 6211-Ni interface in the TC4/Ta/Ni/6211 composite plate displayed good solid solution formation. The strengthening mechanism of the Ta/Ni dual-interlayer interfacial bonding was analyzed using selected area electron diffraction (SAED), revealing that the Ta-Ni diffusion region consisted of Ni<sub>3</sub>Ta and Ni<sub>2</sub>Ta. The addition of the Ta/Ni dual-interlayer prevented the aggregation of Ti and Fe atoms to form Ti-Fe compounds. The malleable intermetallic compounds of Ni<sub>3</sub>Ta and Ni<sub>2</sub>Ta effectively coordinated deformation, leading to an average interfacial bonding strength of 469 MPa, which was 45.2 % higher than the composite plate without Ta/Ni dual-interlayer.</div></div>\",\"PeriodicalId\":23559,\"journal\":{\"name\":\"Vacuum\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.8000,\"publicationDate\":\"2024-09-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Vacuum\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0042207X24006158\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X24006158","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Effect of Ta/Ni dual-interlayer on the microstructure and properties of high strength titanium alloy and steel composite plate
The combination of ultra-high-strength Ti-6Al-4V (TC4) titanium alloy and 30CrNiMoNb (6211) steel was achieved by adding Ta/Ni dual-interlayer and rolling at 950 °C through welding a symmetrical blank sleeve with a vacuum electron beam. In order to unveil the metallurgical bonding mechanism and the interfacial structure, SEM, XRD, and compression-shear performance tests were used. The results revealed the presence of thin-film brittle TiC, TiFe, and TiFe2 compounds at the TC4/6211 interface, resulting in an increased risk of interface mismatch and brittle fracture along the matrix phase interface, and the average interfacial bonding strength was tested at 323 MPa.
In contrast, the TC4-Ta interface and the 6211-Ni interface in the TC4/Ta/Ni/6211 composite plate displayed good solid solution formation. The strengthening mechanism of the Ta/Ni dual-interlayer interfacial bonding was analyzed using selected area electron diffraction (SAED), revealing that the Ta-Ni diffusion region consisted of Ni3Ta and Ni2Ta. The addition of the Ta/Ni dual-interlayer prevented the aggregation of Ti and Fe atoms to form Ti-Fe compounds. The malleable intermetallic compounds of Ni3Ta and Ni2Ta effectively coordinated deformation, leading to an average interfacial bonding strength of 469 MPa, which was 45.2 % higher than the composite plate without Ta/Ni dual-interlayer.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.