关于填充过程中恢复挤压导致挤压型增材制造中层内结合力减弱的研究

IF 5 2区 材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING Polymer Testing Pub Date : 2024-09-24 DOI:10.1016/j.polymertesting.2024.108595
Eduardo Burkot Hungria, Felipe Gonçalves Di Nisio, Francisco Cezar Cano, Rafael Voltolini, Neri Volpato
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引用次数: 0

摘要

通过材料挤压增材制造技术获得的印刷聚合物部件的强度在很大程度上受到沉积长丝(珠)之间的粘合质量的影响。长丝粘合通常与材料温度有关,可在层间(层间)和同层(层内)观察到。文献中对后者的研究不多,当材料挤出必须重新开始以完成层间填充时,对后者的研究也很少。非连续刀具路径通常出现在采用光栅策略填充复杂几何形状的零件时,在这种情况下,需要填充的区域被划分为多个连续光栅段(CRS)。两个相邻 CRS 的细丝之间的接触(密度为 100%)(为简单起见定义为恢复接触 (RC))可能会受到弱粘合效应的影响。这项工作旨在通过改变恢复印刷的时间,使 RC 处的温度下降,并测量其对粘合强度的影响,从而对这种效应进行实验研究。此外,还对恢复挤压时的珠宽进行了分析。结果表明,对于所测试的部件几何形状和所使用的打印机,恢复打印所需的时间(接触温度)对粘合强度的影响并不显著。尽管如此,材料在拉伸载荷下的失效总是发生在 RC 区域。结果还显示,由于挤出开始时挤出量不足,珠子宽度会有一些变化,这可能会减小接触面积。因此,RC 处的层内结合力较弱是一个事实,除其他因素外,它还受到冷结合力和挤出开始时挤出不足导致接触面积减少的综合影响。在印刷材料强度至关重要的最终使用部件时,必须仔细考虑这一问题。
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A study about weak intralayer bonding in extrusion-based additive manufacturing due to resumed extrusion during filling
The strength of a printed polymeric component obtained by a material extrusion additive manufacturing technology is highly affected by the bonding quality between the deposited filaments (beads). Filament bonding is usually associated with material temperature and can be observed between layers (interlayer) and in the same layer (intralayer). The latter is not much explored in the literature and is rarely studied when the material extrusion must be resumed to complete a layer filling. A non-continuous tool path is usually found in filling complex part geometries with a raster strategy, where the area to be filled is divided into more than one continuous raster segment (CRS). The contact between the filaments of two adjacent CRSs (at 100 % density), defined as resumed contact (RC) for simplicity, can be affected by a weak bonding effect. This work aimed to experimentally study this effect by varying the time taken to resume printing, causing the temperature to drop at the RC, and measuring the influence on bonding strength. The bead width at the resumed extrusion was also analyzed. The results show that the influence of time taken to resume printing (contact temperature) on bonding strength was not significant for the part geometry tested and printer used. Notwithstanding, material failure under tensile load always occurred in the RC region. The results also showed some bead width variation due to under extrusion at the start of the extrusion, which can reduce the contact area. Therefore, the weak intralayer bonding at the RC is a fact, and it is affected, among others, by a combination of cold bonding and any contact area reduction due to under extrusion at the start of the extrusion. This issue must be carefully considered when printing an end-use part where the material strength is paramount.
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来源期刊
Polymer Testing
Polymer Testing 工程技术-材料科学:表征与测试
CiteScore
10.70
自引率
5.90%
发文量
328
审稿时长
44 days
期刊介绍: Polymer Testing focuses on the testing, analysis and characterization of polymer materials, including both synthetic and natural or biobased polymers. Novel testing methods and the testing of novel polymeric materials in bulk, solution and dispersion is covered. In addition, we welcome the submission of the testing of polymeric materials for a wide range of applications and industrial products as well as nanoscale characterization. The scope includes but is not limited to the following main topics: Novel testing methods and Chemical analysis • mechanical, thermal, electrical, chemical, imaging, spectroscopy, scattering and rheology Physical properties and behaviour of novel polymer systems • nanoscale properties, morphology, transport properties Degradation and recycling of polymeric materials when combined with novel testing or characterization methods • degradation, biodegradation, ageing and fire retardancy Modelling and Simulation work will be only considered when it is linked to new or previously published experimental results.
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