{"title":"关于 \"利用纳米流体的自然对流机制冷却方形围墙角落的嵌入式热板：数值模拟\" [Case Stud.","authors":"","doi":"10.1016/j.csite.2024.105221","DOIUrl":null,"url":null,"abstract":"<div><div>The following comments address missing information, incomplete mathematical expressions, and the erroneous quantitative findings in the above-mentioned paper. This analysis, therefore, serves as a comparison and correction to the publication “Using natural convection mechanism of nanofluid for cooling an embedded hot plate in corner of a square enclosure: a numerical simulation.” [Case Studies in Thermal Engineering 33 (2022) 101926]</div></div>","PeriodicalId":9658,"journal":{"name":"Case Studies in Thermal Engineering","volume":null,"pages":null},"PeriodicalIF":6.4000,"publicationDate":"2024-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comment on “Using natural convection mechanism of nanofluid for cooling an embedded hot plate in corner of a square enclosure: A numerical simulation” [Case Stud. Therm. Eng. 33, (2022) 101926]\",\"authors\":\"\",\"doi\":\"10.1016/j.csite.2024.105221\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The following comments address missing information, incomplete mathematical expressions, and the erroneous quantitative findings in the above-mentioned paper. This analysis, therefore, serves as a comparison and correction to the publication “Using natural convection mechanism of nanofluid for cooling an embedded hot plate in corner of a square enclosure: a numerical simulation.” [Case Studies in Thermal Engineering 33 (2022) 101926]</div></div>\",\"PeriodicalId\":9658,\"journal\":{\"name\":\"Case Studies in Thermal Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":6.4000,\"publicationDate\":\"2024-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Case Studies in Thermal Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2214157X24012528\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"THERMODYNAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Case Studies in Thermal Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214157X24012528","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"THERMODYNAMICS","Score":null,"Total":0}
Comment on “Using natural convection mechanism of nanofluid for cooling an embedded hot plate in corner of a square enclosure: A numerical simulation” [Case Stud. Therm. Eng. 33, (2022) 101926]
The following comments address missing information, incomplete mathematical expressions, and the erroneous quantitative findings in the above-mentioned paper. This analysis, therefore, serves as a comparison and correction to the publication “Using natural convection mechanism of nanofluid for cooling an embedded hot plate in corner of a square enclosure: a numerical simulation.” [Case Studies in Thermal Engineering 33 (2022) 101926]
期刊介绍：
Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
