在嵌入 PDMS 的银纳米线上均匀镀金以制造软电子器件的简便策略

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC npj Flexible Electronics Pub Date : 2024-10-04 DOI:10.1038/s41528-024-00349-5
Haechan Park, Sehyun Kim, Juyeong Lee, Kwangmin Kim, Hanah Na, Yeeun Kim, Daeun Kim, Donghyung Shin, BongSoo Kim, Kyoseung Sim
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引用次数: 0

摘要

银纳米线嵌入式聚二甲基硅氧烷(AgNWs/PDMS)电极是各种软电子器件的理想元件,但面临着与有机半导体能量不匹配的问题。在电极上自发形成金(Au)的电化学置换尝试往往会导致金涂层不均匀和微粒化,从而影响器件的性能和稳定性。在本研究中,我们引入了一种新方法,通过在金复合物溶液中添加氯化钠,在 AgNWs/PDMS 电极上形成均匀完整的金涂层。这种添加可减缓电化学置换过程并防止沉淀,从而在 AgNWs 表面形成均匀完整的金涂层。这种镀层可大大降低接触电阻(RC),从而提高 p 型有机晶体管的电气特性。此外,通过有机半导体-弹性体混合物,还开发出了高性能全软有机晶体管。此外,利用金涂层在葡萄糖传感过程中防止氧化的优势,还开发出了可靠、机械稳定的软葡萄糖传感器。
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Facile strategy for uniform gold coating on silver nanowires embedded PDMS for soft electronics
Silver nanowires-embedded polydimethylsiloxane (AgNWs/PDMS) electrodes are promising components for various soft electronics, but face energy mismatch with organic semiconductors. Attempts at galvanic replacement, involving spontaneous gold (Au) formation on the electrodes, often result in non-uniform and particulate Au coatings, compromising device performance and stability. In this study, we introduce a novel approach for achieving a uniform and complete Au coating on AgNWs/PDMS electrodes by adding NaCl to the Au complex solution. This addition slows down the galvanic replacement process and prevents precipitation, enabling a uniform and complete Au coating on the AgNWs surface. Such coating significantly reduces contact resistance (RC), thereby enhancing the electrical characteristics of p-type organic transistors. Furthermore, the development of high-performance, fully soft organic transistors was achieved incorporating an organic semiconductor-elastomer blend. Additionally, reliable, mechanically stable soft glucose sensor was developed, taking advantage of the complete Au coating, which protects against oxidation during the glucose sensing process.
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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