Qi Liu , Liang Xu , Ji Zou , Jingjing Liu , Shuaihang Qiu , Wei Ji , Weimin Wang , Zhengyi Fu
{"title":"具有独特高温机械和物理特性的致密九元素高熵二硼化物陶瓷","authors":"Qi Liu , Liang Xu , Ji Zou , Jingjing Liu , Shuaihang Qiu , Wei Ji , Weimin Wang , Zhengyi Fu","doi":"10.1016/j.compositesb.2024.111868","DOIUrl":null,"url":null,"abstract":"<div><div>Due to their huge composition space and superior performance characteristics, high entropy borides have garnered great interest in many fields, particularly where their high-temperature performances at high temperatures are critical. Herein, we first discovered that dense (Ti<sub>1/9</sub>Zr<sub>1/9</sub>Hf<sub>1/9</sub>Nb<sub>1/9</sub>Ta<sub>1/9</sub>V<sub>1/9</sub>Cr<sub>1/9</sub>Mo<sub>1/9</sub>W<sub>1/9</sub>)B<sub>2</sub> (HEB9) ceramics prepared at 1850 °C showed an exceptionally low temperature coefficient of electrical resistivity (4.28 × 10<sup>−4</sup> K<sup>−1</sup>), which is ∼38% of that of (Ti<sub>1/5</sub>Zr<sub>1/5</sub>Hf<sub>1/5</sub>Nb<sub>1/5</sub>Ta<sub>1/5</sub>)B<sub>2</sub> (HEB5) and nearly an order of magnitude lower than those of previously reported ZrB<sub>2</sub> and ZrB<sub>2</sub>-30 vol% SiC ceramics. Their mechanical, thermophysical properties at elevated temperatures were also investigated systematically. Although the thermal conductivity of HEB9 increased with elevated temperatures, it remained at a very low level (∼29 W/(m·K)) at 1273 K, nearly half that of HEB5. Interestingly, it is found that the thermal conduction of HEB9 and HEB5 was mainly contributed by electrons, suggeting their thermal conductivity could be roughly estimated from corresponding electrical conductivity values. Moreover, HEB9 exhibited a geometrically necessary dislocation density over 30 times greater than HEB5, likely contributing to its higher Vickers hardness and unique physical properties. Notably, the flexural strength of HEB9 at 1600 °C was even improved to 650.0 ± 86.3 MPa, compared to the value (559.7 ± 36.7 MPa) at room temperature without degradation, which was comparable to that of HEB5, although thermodynamic calculations indicated a lower melting point of HEB9 and grain boundary softening was occurred in HEB9 at higher temperatures. The excellent mechanical, electrical and thermophysical properties of HEB9 at elevated temperatures make it a competitive candidate for various high-temperature applications.</div></div>","PeriodicalId":10660,"journal":{"name":"Composites Part B: Engineering","volume":"287 ","pages":"Article 111868"},"PeriodicalIF":12.7000,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Dense nine elemental high entropy diboride ceramics with unique high temperature mechanical and physical properties\",\"authors\":\"Qi Liu , Liang Xu , Ji Zou , Jingjing Liu , Shuaihang Qiu , Wei Ji , Weimin Wang , Zhengyi Fu\",\"doi\":\"10.1016/j.compositesb.2024.111868\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Due to their huge composition space and superior performance characteristics, high entropy borides have garnered great interest in many fields, particularly where their high-temperature performances at high temperatures are critical. Herein, we first discovered that dense (Ti<sub>1/9</sub>Zr<sub>1/9</sub>Hf<sub>1/9</sub>Nb<sub>1/9</sub>Ta<sub>1/9</sub>V<sub>1/9</sub>Cr<sub>1/9</sub>Mo<sub>1/9</sub>W<sub>1/9</sub>)B<sub>2</sub> (HEB9) ceramics prepared at 1850 °C showed an exceptionally low temperature coefficient of electrical resistivity (4.28 × 10<sup>−4</sup> K<sup>−1</sup>), which is ∼38% of that of (Ti<sub>1/5</sub>Zr<sub>1/5</sub>Hf<sub>1/5</sub>Nb<sub>1/5</sub>Ta<sub>1/5</sub>)B<sub>2</sub> (HEB5) and nearly an order of magnitude lower than those of previously reported ZrB<sub>2</sub> and ZrB<sub>2</sub>-30 vol% SiC ceramics. Their mechanical, thermophysical properties at elevated temperatures were also investigated systematically. Although the thermal conductivity of HEB9 increased with elevated temperatures, it remained at a very low level (∼29 W/(m·K)) at 1273 K, nearly half that of HEB5. Interestingly, it is found that the thermal conduction of HEB9 and HEB5 was mainly contributed by electrons, suggeting their thermal conductivity could be roughly estimated from corresponding electrical conductivity values. Moreover, HEB9 exhibited a geometrically necessary dislocation density over 30 times greater than HEB5, likely contributing to its higher Vickers hardness and unique physical properties. Notably, the flexural strength of HEB9 at 1600 °C was even improved to 650.0 ± 86.3 MPa, compared to the value (559.7 ± 36.7 MPa) at room temperature without degradation, which was comparable to that of HEB5, although thermodynamic calculations indicated a lower melting point of HEB9 and grain boundary softening was occurred in HEB9 at higher temperatures. The excellent mechanical, electrical and thermophysical properties of HEB9 at elevated temperatures make it a competitive candidate for various high-temperature applications.</div></div>\",\"PeriodicalId\":10660,\"journal\":{\"name\":\"Composites Part B: Engineering\",\"volume\":\"287 \",\"pages\":\"Article 111868\"},\"PeriodicalIF\":12.7000,\"publicationDate\":\"2024-10-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Composites Part B: Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1359836824006802\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composites Part B: Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1359836824006802","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
Dense nine elemental high entropy diboride ceramics with unique high temperature mechanical and physical properties
Due to their huge composition space and superior performance characteristics, high entropy borides have garnered great interest in many fields, particularly where their high-temperature performances at high temperatures are critical. Herein, we first discovered that dense (Ti1/9Zr1/9Hf1/9Nb1/9Ta1/9V1/9Cr1/9Mo1/9W1/9)B2 (HEB9) ceramics prepared at 1850 °C showed an exceptionally low temperature coefficient of electrical resistivity (4.28 × 10−4 K−1), which is ∼38% of that of (Ti1/5Zr1/5Hf1/5Nb1/5Ta1/5)B2 (HEB5) and nearly an order of magnitude lower than those of previously reported ZrB2 and ZrB2-30 vol% SiC ceramics. Their mechanical, thermophysical properties at elevated temperatures were also investigated systematically. Although the thermal conductivity of HEB9 increased with elevated temperatures, it remained at a very low level (∼29 W/(m·K)) at 1273 K, nearly half that of HEB5. Interestingly, it is found that the thermal conduction of HEB9 and HEB5 was mainly contributed by electrons, suggeting their thermal conductivity could be roughly estimated from corresponding electrical conductivity values. Moreover, HEB9 exhibited a geometrically necessary dislocation density over 30 times greater than HEB5, likely contributing to its higher Vickers hardness and unique physical properties. Notably, the flexural strength of HEB9 at 1600 °C was even improved to 650.0 ± 86.3 MPa, compared to the value (559.7 ± 36.7 MPa) at room temperature without degradation, which was comparable to that of HEB5, although thermodynamic calculations indicated a lower melting point of HEB9 and grain boundary softening was occurred in HEB9 at higher temperatures. The excellent mechanical, electrical and thermophysical properties of HEB9 at elevated temperatures make it a competitive candidate for various high-temperature applications.
期刊介绍:
Composites Part B: Engineering is a journal that publishes impactful research of high quality on composite materials. This research is supported by fundamental mechanics and materials science and engineering approaches. The targeted research can cover a wide range of length scales, ranging from nano to micro and meso, and even to the full product and structure level. The journal specifically focuses on engineering applications that involve high performance composites. These applications can range from low volume and high cost to high volume and low cost composite development.
The main goal of the journal is to provide a platform for the prompt publication of original and high quality research. The emphasis is on design, development, modeling, validation, and manufacturing of engineering details and concepts. The journal welcomes both basic research papers and proposals for review articles. Authors are encouraged to address challenges across various application areas. These areas include, but are not limited to, aerospace, automotive, and other surface transportation. The journal also covers energy-related applications, with a focus on renewable energy. Other application areas include infrastructure, off-shore and maritime projects, health care technology, and recreational products.