用硅酮密封剂填充轴向沟槽,增强管道冷却效果

IF 1.8 3区 工程技术 Q3 PHYSICS, APPLIED Cryogenics Pub Date : 2024-10-01 DOI:10.1016/j.cryogenics.2024.103957
Katsuyoshi Fukiba, Kohei Suda, Ibuki Hori
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引用次数: 0

摘要

本研究提出了一种利用液氮流加速管道冷却过程的方法。沿管道内表面加工出轴向凹槽,然后填充硅酮密封剂。与之前提出的方法相比,这种方法可以缩短冷却时间。为确定最佳沟槽宽度和沟槽与密封剂面积之比,进行了液氮池沸腾的初步实验。当沟槽间距接近毛细管长度时,池沸腾的冷却时间最短。铜与硅酮密封剂面积比对冷却过程的影响很小。间距为 2 毫米、铜硅密封剂面积比为 0.25 的表面的冷却时间最短。冷却时间是裸表面的 1/4.4。不同间距和沟槽宽度的管道在流动冷却实验中进行了测试。利用表面纹理,外径为 1/2 英寸、长度为 120 毫米的不锈钢管从室温到饱和温度的冷却时间缩短到最多 1/3.6。沟槽间距为 2 毫米时,冷却时间最短。除了冷却时间缩短外,冷却所需的液氮量也减少了。
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Enhancing pipe chilldown with axial grooves filled with silicone sealant
This study proposes a method to accelerate the chilldown process in pipes using liquid nitrogen flow. Axial grooves were machined along the inner surface of the pipe and then filled with silicone sealant. This approach achieves a shorter chilldown time compared to previously proposed methods. Initial experiments involving pool boiling in liquid nitrogen were conducted to determine the optimal groove width and the ratio of groove-to-sealant area. The shortest chilldown time in pool boiling was achieved when the groove pitch was close to the capillary length. The effect of the copper-to-silicone sealant area ratio on the chilldown process was minimal. The shortest chilldown time was achieved with a surface that had a 2 mm pitch and a copper-to-silicone sealant area ratio of 0.25. The chilldown time was 1/4.4 of that of the bare surface. Pipes with different pitch and groove widths were tested in a flow chilldown experiment. Using the surface texture, the chilldown time of a stainless-steel pipe with an outer diameter of 1/2″ and a length of 120 mm from room temperature to the saturation temperature was reduced to a maximum of 1/3.6. The shortest cooling time is obtained at a groove pitch of 2 mm. In addition to the shorter cooling time, the amount of liquid nitrogen required for chilldown was also reduced.
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来源期刊
Cryogenics
Cryogenics 物理-热力学
CiteScore
3.80
自引率
9.50%
发文量
0
审稿时长
2.1 months
期刊介绍: Cryogenics is the world''s leading journal focusing on all aspects of cryoengineering and cryogenics. Papers published in Cryogenics cover a wide variety of subjects in low temperature engineering and research. Among the areas covered are: - Applications of superconductivity: magnets, electronics, devices - Superconductors and their properties - Properties of materials: metals, alloys, composites, polymers, insulations - New applications of cryogenic technology to processes, devices, machinery - Refrigeration and liquefaction technology - Thermodynamics - Fluid properties and fluid mechanics - Heat transfer - Thermometry and measurement science - Cryogenics in medicine - Cryoelectronics
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