Experimental characterisation and visualisation of a novel two-phase flexible heat transfer device

The importance of passive Flexible Heat Transfer Device (FHTD) in electronic cooling or space applications lies in their ability to provide efficient, reliable, and adaptable thermal management solutions. Heat transfer enhancement studies pertaining to FHTD developed to meet the thermal management demands of futuristic flexible electronic devices are presented in the current work. The possibility of extending the heat transport limit of FHTD beyond 24 W by limiting the maximum operating temperature to 60 °C is discussed. The superior performance of FHTD at varying heat loads from 5 W to 40 W at 45°and 90°bending angles is brought out compared with existing heat transfer devices like Flexible Heat Pipe (FHP) and copper thermal straps. The performance is reported in thermal resistance and equivalent thermal conductivity. A commercial dielectric liquid is used as a working fluid in FHTD to enhance the heat transfer limit employing phase change. The evaporator and condenser sections of the flexible section are made transparent to visualise the boiling and condensation phenomenon. Under steady-state operation at a 45°bending angle, The FHTD demonstrates a minimum thermal resistance of 0.73 K/W and a peak effective thermal conductivity of 8172 W/m K. The heat transfer coefficient ranges from 200 to 700 W/m${}^2$ K, consistent with values reported for heat pipes in the literature. Additionally, the study explores the impact of modifying the external surface texture to create more nucleation sites, thereby enhancing the performance of the FHTD. The results show that the laser-textured surface on the heat pipe condenser effectively reduces the onset of nucleate boiling for dielectric fluid by 3.5 °C and decreases the maximum temperature of the evaporator by 4.5 °C. The present work dictates the fundamental baseline for possible design choices of futuristic passive flexible heat transfer devices.