保温时间对 T2Cu/Al1060 扩散接合层微观结构演变和性能的影响

IF 2.4 4区 材料科学 Q2 METALLURGY & METALLURGICAL ENGINEERING Welding in the World Pub Date : 2024-09-23 DOI:10.1007/s40194-024-01838-x
Yunlong Ding, Wenjie Shao, Zhiguo Zhuang, Bingyang Liu, Bing Han
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引用次数: 0

摘要

本文采用真空扩散焊接工艺实现了 T2 铜和 Al1060 的焊接。研究了铜/铝扩散结合层的微观结构演变、力学性能和耐腐蚀性能。结果表明,在 530 °C 保温 60 分钟的焊接条件下,接头处会产生金属间化合物 Al2Cu、AlCu 和 Al4Cu9。当保温时间达到 90 分钟时,会产生新的 Al2Cu3 相,扩散结合层演变成四层结构。扩散层的厚度随着保温时间的延长而增加,并受到体扩散的影响。随着保温时间的延长,接头的剪切强度先增大后减小。在保持时间为 60 分钟的条件下,可获得 20.91 MPa 的最大剪切强度,断裂主要发生在 Al2Cu 和 AlCu 相之间。金属间化合物相的纳米压痕硬度和弹性模量远高于铜和铝基体。具体来说,Al4Cu9 相的纳米压痕硬度和弹性模量最大,分别为 11.062 GPa 和 132.8 GPa。扩散结合层的耐腐蚀性与基体材料的耐腐蚀性有很大不同。与铜相比,各扩散层和铝基体的腐蚀电位相对较低。扩散层和基体材料的腐蚀速率从大到小依次为 Al > Al2Cu > AlCu > Al4Cu9 > Cu。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Effect of holding time on microstructure evolution and properties of T2Cu/Al1060 diffusion bonding layer

In this paper, the welding of T2 copper and Al1060 was realized by vacuum diffusion welding process. The microstructure evolution, mechanical properties, and corrosion resistance of Cu/Al diffusion bonding layer were explored. The results show that intermetallic compounds Al2Cu, AlCu, and Al4Cu9 generate at the joint under the welding condition of holding for 60 min at 530 °C. When the holding time reaches 90 min, a new phase of Al2Cu3 generates, and the diffusion bonding layer evolves into a four-layer structure. The thickness of diffusion layer increases with the extension of holding time and is affected by the body diffusion. The shear strength of the joint increases first and then decreases with the extension of holding time. The maximum shear strength of 20.91 MPa can be obtained under the holding time condition of 60 min, and fracture mainly occurs between Al2Cu and AlCu phases. Nanoindentation hardness and elastic modulus of intermetallic compound phase are much higher than those of copper and aluminum matrix. Specifically, Al4Cu9 phase exhibits the largest nanoindentation hardness and elastic modulus of 11.062 GPa and 132.8 GPa. The corrosion resistance of diffusion bonding layers is significantly different from that of the base material. Compared with copper, the corrosion potential of each diffusion layer and aluminum matrix is relatively lower. The corrosion rates of diffusion layers and base materials are in descending order of Al > Al2Cu > AlCu > Al4Cu9 > Cu.

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来源期刊
Welding in the World
Welding in the World METALLURGY & METALLURGICAL ENGINEERING-
CiteScore
4.20
自引率
14.30%
发文量
181
审稿时长
6-12 weeks
期刊介绍: The journal Welding in the World publishes authoritative papers on every aspect of materials joining, including welding, brazing, soldering, cutting, thermal spraying and allied joining and fabrication techniques.
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