从超声阵列数据集中的反向散射信号测量金属材料的微观结构晶粒尺寸

IF 4.1 2区 材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING Ndt & E International Pub Date : 2024-10-16 DOI:10.1016/j.ndteint.2024.103251
Weixin Wang, Jie Zhang, Paul D. Wilcox
{"title":"从超声阵列数据集中的反向散射信号测量金属材料的微观结构晶粒尺寸","authors":"Weixin Wang,&nbsp;Jie Zhang,&nbsp;Paul D. Wilcox","doi":"10.1016/j.ndteint.2024.103251","DOIUrl":null,"url":null,"abstract":"<div><div>Ultrasound backscattering signals from material microstructures can be used to evaluate the material microstructure grain size. This typically involves making pulse-echo immersion measurements at multiple locations using a focused ultrasonic transducer in order to obtain an accurate estimate of the root-mean-square amplitude of the back-scattered signal at a specified focal position. However, this restricts some practical applications of using such techniques in, for example, on-line measurements in high-value manufacturing and in-service inspections where multiple immersion measurements are not feasible to use. The main benefit of using ultrasonic phased arrays is that one array probe at one position can focus ultrasound beams at multiple points using different focal laws either physically or in data postprocessing. Potentially this means that accurate grain size measurements can be obtained from a single array measurement. In this paper, the classic backscattering method for conventional transducers is adapted to be used for full matrix capture datasets from an ultrasonic array. Three-dimensional ultrasonic models are developed in the proposed inverse process to measure material microstructure grain size. Experimental validations were performed on two metallic materials: copper (EN1652) and bright mild steel (BS970). A good agreement is shown between the experimentally measured grain sizes from array data and metallography measurements. Compared to the classic pulse-echo immersion back-scattering measurements, the proposed method enables accurate measurement of grain size in a direct contact configuration at fewer locations. This has potential to make on-line grain size measurements possible.</div></div>","PeriodicalId":18868,"journal":{"name":"Ndt & E International","volume":"149 ","pages":"Article 103251"},"PeriodicalIF":4.1000,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Metallic material microstructure grain size measurements from backscattering signals in ultrasonic array data sets\",\"authors\":\"Weixin Wang,&nbsp;Jie Zhang,&nbsp;Paul D. Wilcox\",\"doi\":\"10.1016/j.ndteint.2024.103251\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Ultrasound backscattering signals from material microstructures can be used to evaluate the material microstructure grain size. This typically involves making pulse-echo immersion measurements at multiple locations using a focused ultrasonic transducer in order to obtain an accurate estimate of the root-mean-square amplitude of the back-scattered signal at a specified focal position. However, this restricts some practical applications of using such techniques in, for example, on-line measurements in high-value manufacturing and in-service inspections where multiple immersion measurements are not feasible to use. The main benefit of using ultrasonic phased arrays is that one array probe at one position can focus ultrasound beams at multiple points using different focal laws either physically or in data postprocessing. Potentially this means that accurate grain size measurements can be obtained from a single array measurement. In this paper, the classic backscattering method for conventional transducers is adapted to be used for full matrix capture datasets from an ultrasonic array. Three-dimensional ultrasonic models are developed in the proposed inverse process to measure material microstructure grain size. Experimental validations were performed on two metallic materials: copper (EN1652) and bright mild steel (BS970). A good agreement is shown between the experimentally measured grain sizes from array data and metallography measurements. Compared to the classic pulse-echo immersion back-scattering measurements, the proposed method enables accurate measurement of grain size in a direct contact configuration at fewer locations. This has potential to make on-line grain size measurements possible.</div></div>\",\"PeriodicalId\":18868,\"journal\":{\"name\":\"Ndt & E International\",\"volume\":\"149 \",\"pages\":\"Article 103251\"},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2024-10-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ndt & E International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0963869524002160\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ndt & E International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0963869524002160","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
引用次数: 0

摘要

材料微结构的超声波反向散射信号可用于评估材料微结构的晶粒尺寸。这通常需要使用聚焦超声换能器在多个位置进行脉冲回波浸入式测量,以获得特定焦点位置的反向散射信号均方根振幅的精确估算值。然而,这限制了此类技术的一些实际应用,例如在高价值制造和在役检查中的在线测量中,使用多次浸入测量是不可行的。使用超声相控阵的主要好处是,在一个位置上的一个阵列探头可以使用不同的焦距法将超声波束聚焦在多个点上,无论是在物理上还是在数据后处理中。这可能意味着通过单个阵列测量即可获得精确的粒度测量结果。在本文中,传统传感器的经典反向散射方法被调整用于超声阵列的全矩阵捕获数据集。在拟议的逆过程中开发了三维超声波模型,用于测量材料的微观结构晶粒尺寸。对两种金属材料:铜(EN1652)和光亮低碳钢(BS970)进行了实验验证。实验结果表明,阵列数据测量的晶粒尺寸与金相测量结果之间具有良好的一致性。与传统的脉冲回波浸入式反向散射测量相比,所提出的方法能够在更少的位置以直接接触的方式精确测量晶粒尺寸。这使在线晶粒尺寸测量成为可能。
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Metallic material microstructure grain size measurements from backscattering signals in ultrasonic array data sets
Ultrasound backscattering signals from material microstructures can be used to evaluate the material microstructure grain size. This typically involves making pulse-echo immersion measurements at multiple locations using a focused ultrasonic transducer in order to obtain an accurate estimate of the root-mean-square amplitude of the back-scattered signal at a specified focal position. However, this restricts some practical applications of using such techniques in, for example, on-line measurements in high-value manufacturing and in-service inspections where multiple immersion measurements are not feasible to use. The main benefit of using ultrasonic phased arrays is that one array probe at one position can focus ultrasound beams at multiple points using different focal laws either physically or in data postprocessing. Potentially this means that accurate grain size measurements can be obtained from a single array measurement. In this paper, the classic backscattering method for conventional transducers is adapted to be used for full matrix capture datasets from an ultrasonic array. Three-dimensional ultrasonic models are developed in the proposed inverse process to measure material microstructure grain size. Experimental validations were performed on two metallic materials: copper (EN1652) and bright mild steel (BS970). A good agreement is shown between the experimentally measured grain sizes from array data and metallography measurements. Compared to the classic pulse-echo immersion back-scattering measurements, the proposed method enables accurate measurement of grain size in a direct contact configuration at fewer locations. This has potential to make on-line grain size measurements possible.
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来源期刊
Ndt & E International
Ndt & E International 工程技术-材料科学:表征与测试
CiteScore
7.20
自引率
9.50%
发文量
121
审稿时长
55 days
期刊介绍: NDT&E international publishes peer-reviewed results of original research and development in all categories of the fields of nondestructive testing and evaluation including ultrasonics, electromagnetics, radiography, optical and thermal methods. In addition to traditional NDE topics, the emerging technology area of inspection of civil structures and materials is also emphasized. The journal publishes original papers on research and development of new inspection techniques and methods, as well as on novel and innovative applications of established methods. Papers on NDE sensors and their applications both for inspection and process control, as well as papers describing novel NDE systems for structural health monitoring and their performance in industrial settings are also considered. Other regular features include international news, new equipment and a calendar of forthcoming worldwide meetings. This journal is listed in Current Contents.
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