桥接液态金属的银纳米粒子用于可穿戴式电磁干扰织物

IF 11.2 1区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Journal of Materials Science & Technology Pub Date : 2024-10-24 DOI:10.1016/j.jmst.2024.10.006
Gui Yang, Xiaoyuan Zhang, Jingzhan Zhu, Zichao Li, Duo Pan, Fengmei Su, Youxin Ji, Chuntai Liu, Changyu Shen
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引用次数: 0

摘要

可拉伸导电纤维对于可穿戴电子纺织品的发展至关重要。然而,由于电子传输中断,纤维在拉伸时导电性会急剧下降,这给我们带来了巨大的挑战。在纤维上涂覆软液态金属(LM)已成为一种很有前景的解决方案。尽管如此,仍然迫切需要开发既能增强液态金属对基底的附着力,又能促进高效电子传输途径的方法。本研究展示了一种新型银-LM 导电网络策略,用于制造热塑性聚氨酯/多巴胺/银-LM(TPU/PDA/Ag-LM)纤维膜。这种膜具有出色的可拉伸电磁干扰(EMI)屏蔽性能,可通过简单的电纺丝、无电沉积、LM 涂层和活化工艺制成。TPU/PDA/Ag 纤维膜最初是通过多巴胺辅助在电纺丝 TPU 纤维上沉积银纳米粒子 (AgNPs) 制成的。TPU/PDA 纤维表面的 AgNPs 可增强 LM 与基底的粘附性,并将相邻的 LM 连接起来,从而建立有效的导电路径。这种相互作用得益于 AgNPs 和 LM 之间的反应性合金化,LM 渗入 AgNPs 之间的间隙,形成独特的 LM-Ag 合金层,均匀地覆盖在 TPU 纤维表面。正如预期的那样,独特的三维(3D)互连 LM-Ag 导电网络在拉伸过程中保持完好无损,确保了应变不变的导电性。制成的 TPU/PDA/Ag-LM 纤维膜在 8.2-12.8 GHz 频率范围内显示出 77.4 dB 的出色 EMI 屏蔽效果(SE),并在 300% 的拉伸变形下保持 37.2 dB 的出色 EMI SE。此外,TPU/PDA/Ag-LM 纤维膜显示出卓越的机械性能和稳定的焦耳热性能,即使在大幅拉伸的情况下也是如此。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Silver nanoparticles bridging liquid metal for wearable electromagnetic interference fabric
Stretchable conductive fibers are essential for the advancement of wearable electronic textiles. However, a significant challenge arises as their conductivity sharply decreases when stretched due to disruptions in electronic transport. Coating fibers with soft liquid metal (LM) has emerged as a promising solution. Despite this, there remains an urgent need to develop methods that enhance LM adhesion to substrates while facilitating efficient electron transport pathways. This study demonstrates a novel Ag-LM conductive network strategy for fabricating a thermoplastic polyurethane/polydopamine/silver-LM (TPU/PDA/Ag-LM) fiber membrane. This membrane exhibits outstanding stretchable electromagnetic interference (EMI) shielding performance and is produced through straightforward electrospinning, electroless depositing, and LM coating and activation. The TPU/PDA/Ag fiber membrane is initially prepared via polydopamine-assisted deposition of silver nanoparticles (AgNPs) on electrospun TPU fibers. The presence of AgNPs on the surface of TPU/PDA fibers enhances LM adhesion to the substrate and bridges adjacent LM to establish efficient conductive paths. This interaction benefits from the reactive alloying between AgNPs and LM, where the LM infiltrates the gaps among AgNPs, forming a distinctive LM-Ag alloy layer that uniformly coats the surface of TPU fibers. As anticipated, the unique three-dimensional (3D) interconnected LM-Ag conductive network remains intact during stretching, ensuring strain-invariant conductivity. The fabricated TPU/PDA/Ag-LM fiber membrane demonstrates exceptional EMI shielding effectiveness (SE) of 77.4 dB within the frequency range of 8.2–12.8 GHz and maintains an excellent EMI SE of 37.2 dB under extensive tensile deformation of 300%. Furthermore, the TPU/PDA/Ag-LM fiber membrane shows remarkable mechanical properties and stable Joule heating performance even under significant stretching.
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来源期刊
Journal of Materials Science & Technology
Journal of Materials Science & Technology 工程技术-材料科学:综合
CiteScore
20.00
自引率
11.00%
发文量
995
审稿时长
13 days
期刊介绍: Journal of Materials Science & Technology strives to promote global collaboration in the field of materials science and technology. It primarily publishes original research papers, invited review articles, letters, research notes, and summaries of scientific achievements. The journal covers a wide range of materials science and technology topics, including metallic materials, inorganic nonmetallic materials, and composite materials.
期刊最新文献
Corrigendum to “Vertical graphene-decorated carbon nanofibers establishing robust conductive networks for fiber-based stretchable strain sensors” [Journal of Materials Science & Technology 200 (2024) 52–60] Recent progress of Ti3C2Tx MXene-based layered films for electromagnetic interference shielding Janus-inspired alternating architecture CNF/MXene/ZnFe2O4@PANI composite films with outstanding electromagnetic interference shielding and Joule heating Mechanistic insights into cluster strengthening and grain refinement toughening in fully oxidized AgMgNi alloys Ti3C2Tx/CuO heterojunction for ultrafast photonics
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