{"title":"功率半导体器件的机械应力波非接触式激光检测方法--低频信号观测","authors":"Qiying Li;Yunze He;Mengchuan Li;Yang Ping;Longhai Tang;Xuefeng Geng;Guangxin Wang;Shan Chang;Jie Zhang","doi":"10.1109/TIM.2024.3481529","DOIUrl":null,"url":null,"abstract":"Power semiconductor device condition monitoring technology based on the mechanical stress wave (MSW) is an important means to study device failure mechanisms and evaluate device reliability. However, MSW signals have mainly been detected through acoustic emission (AE) sensors for contact detection. The operating temperature of the device will affect the detection results, and the presence of MSW low-frequency components may be overlooked due to limitations in sensor performance. This article proposes an offline, noncontact MSW measurement method based on a laser Doppler vibrometer for power semiconductor devices. This method obtained the complete MSW signal generated during the switching process of power semiconductor devices, especially the low-frequency components below 20 kHz. Moreover, the proposed method exhibits greater sensitivity in detecting the high-frequency components of the MSW compared to contact detection. This study extends the detection methods and frequency ranges for the MSW in power semiconductor devices, thereby expecting to facilitate the generation and propagation mechanisms research of the MSW.","PeriodicalId":13341,"journal":{"name":"IEEE Transactions on Instrumentation and Measurement","volume":null,"pages":null},"PeriodicalIF":5.6000,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mechanical Stress Wave Noncontact Laser Detection Method of Power Semiconductor Devices—Observation of Low-Frequency Signals\",\"authors\":\"Qiying Li;Yunze He;Mengchuan Li;Yang Ping;Longhai Tang;Xuefeng Geng;Guangxin Wang;Shan Chang;Jie Zhang\",\"doi\":\"10.1109/TIM.2024.3481529\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power semiconductor device condition monitoring technology based on the mechanical stress wave (MSW) is an important means to study device failure mechanisms and evaluate device reliability. However, MSW signals have mainly been detected through acoustic emission (AE) sensors for contact detection. The operating temperature of the device will affect the detection results, and the presence of MSW low-frequency components may be overlooked due to limitations in sensor performance. This article proposes an offline, noncontact MSW measurement method based on a laser Doppler vibrometer for power semiconductor devices. This method obtained the complete MSW signal generated during the switching process of power semiconductor devices, especially the low-frequency components below 20 kHz. Moreover, the proposed method exhibits greater sensitivity in detecting the high-frequency components of the MSW compared to contact detection. This study extends the detection methods and frequency ranges for the MSW in power semiconductor devices, thereby expecting to facilitate the generation and propagation mechanisms research of the MSW.\",\"PeriodicalId\":13341,\"journal\":{\"name\":\"IEEE Transactions on Instrumentation and Measurement\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":5.6000,\"publicationDate\":\"2024-10-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Instrumentation and Measurement\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10720182/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Instrumentation and Measurement","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10720182/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Mechanical Stress Wave Noncontact Laser Detection Method of Power Semiconductor Devices—Observation of Low-Frequency Signals
Power semiconductor device condition monitoring technology based on the mechanical stress wave (MSW) is an important means to study device failure mechanisms and evaluate device reliability. However, MSW signals have mainly been detected through acoustic emission (AE) sensors for contact detection. The operating temperature of the device will affect the detection results, and the presence of MSW low-frequency components may be overlooked due to limitations in sensor performance. This article proposes an offline, noncontact MSW measurement method based on a laser Doppler vibrometer for power semiconductor devices. This method obtained the complete MSW signal generated during the switching process of power semiconductor devices, especially the low-frequency components below 20 kHz. Moreover, the proposed method exhibits greater sensitivity in detecting the high-frequency components of the MSW compared to contact detection. This study extends the detection methods and frequency ranges for the MSW in power semiconductor devices, thereby expecting to facilitate the generation and propagation mechanisms research of the MSW.
期刊介绍:
Papers are sought that address innovative solutions to the development and use of electrical and electronic instruments and equipment to measure, monitor and/or record physical phenomena for the purpose of advancing measurement science, methods, functionality and applications. The scope of these papers may encompass: (1) theory, methodology, and practice of measurement; (2) design, development and evaluation of instrumentation and measurement systems and components used in generating, acquiring, conditioning and processing signals; (3) analysis, representation, display, and preservation of the information obtained from a set of measurements; and (4) scientific and technical support to establishment and maintenance of technical standards in the field of Instrumentation and Measurement.