甘油表面预处理实现了铜-铜在环境空气中的低温直接键合

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2024-10-30 DOI:10.1016/j.matlet.2024.137640
Wenhua Yang, Kang Lu, Zhenling Tan, Chao Xie, Zhixiang Huang
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引用次数: 0

摘要

铜-铜直接键合的广泛应用受到很大限制,这是因为铜容易氧化,而且键合过程复杂,包括键合温度升高和强制保护气氛。甘油可减少铜的氧化,同时在环境空气中保持还原的铜表面。因此,利用甘油预处理进行还原和保护,在较低温度范围(150 ℃-200 ℃)的环境空气中完成了铜-铜直接键合。研究发现,甘油能有效抑制铜在 200 °C 环境空气中的表面氧化。当粘合温度从 150 °C 升至 200 °C 时,粘合强度从 19.5 MPa 稳步上升至 32.6 MPa。此外,在 200 °C的键合过程中,键合界面呈现出致密、连续的特性,氧化物和碳残留物极少。同时,在键合界面上还观察到了良好的电性能。
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Glycerol surface pretreatment enabled Cu-Cu low-temperature direct bonding in ambient air
The broad application of Cu-Cu direct bonding is substantially constrained owing to the propensity of copper to oxidize, coupled with complex processes including elevated bonding temperatures and compulsory protective atmospheres. Glycerol is employed to diminish Cu oxide while concurrently preserving the reduced Cu surface in ambient air. Cu-Cu direct bonding was thus accomplished at a lower temperature range (150 °C–200 °C) in ambient air, leveraging glycerol pretreatment for the reduction and protection. The effectiveness of glycerol in curtailing the surface oxidation of Cu at 200 °C in ambient air was discovered. The bonding strength exhibited a steady increase from 19.5 MPa to 32.6 MPa as the bonding temperature escalated from 150 °C to 200 °C. Furthermore, in the case of bonding at 200 °C, the bonding interface presented a dense, continuous nature with minimal oxide and carbon residue. Concurrently, good electrical properties were observed at the bonding interface.
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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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