{"title":"金属间化合物 Cu3-x(As,Sb)的晶体化学、热力学和物理特性","authors":"Marianne Mödlinger , Alessia Provino , Pavlo Solokha , Serena De Negri , Federico Caglieris , Michele Ceccardi , Cristina Bernini , Pietro Manfrinetti","doi":"10.1016/j.intermet.2024.108526","DOIUrl":null,"url":null,"abstract":"<div><div>During the investigation of the Cu-As-Sb ternary system, we identified the ternary intermetallic Cu<sub>3−x</sub>(As,Sb) compound. Its crystal structure was solved and refined by single crystal and powder X-ray diffraction. While the binary Cu<sub>3−x</sub>As and Cu<sub>3−x</sub>Sb phases crystallize in the hexagonal Cu<sub>3</sub>P-type (<em>hP</em>24, <em>P</em>6<sub>3</sub><em>cm</em>) and cubic anti-BiF<sub>3</sub>-type (<em>cF</em>16, <em>Fm</em><span><math><mover><mn>3</mn><mo>¯</mo></mover></math></span><em>m</em>), respectively, Cu<sub>3−x</sub>(As,Sb) adopts the cubic Cu<sub>6</sub>AsSb prototype (<em>cP</em>32, <em>Pm</em><span><math><mrow><mover><mn>3</mn><mo>‾</mo></mover></mrow></math></span><em>n</em>). Crystallochemical reasons lead to the exclusion that its structure could be of the UH<sub>3</sub>-type. Cu<sub>3−x</sub>(As,Sb) is isotypic with Cu<sub>12−x</sub>TeSb<sub>3</sub>; their crystal structure is a stuffed ternary derivative of the Cr<sub>3</sub>Si-type. SEM-EDX analyses reveal very large compositional ranges for this compound, mostly concerning the Sb/As ratio: 71.1−73.9 at.% Cu, 4.0−24.5 at.% As and 2.5−23.5 at.% Sb, corresponding to about Cu<sub>2.5-2.8</sub>As<sub>0.23-0.98</sub>Sb<sub>0.23-0.92</sub> (x = 0.2−0.5). The lattice parameter and, consequently, the unit cell volume regularly expand while increasing the Sb/As compositional ratio: <em>a</em> ≈ 7.47 Å for Cu<sub>3−x</sub>As<sub>0.75</sub>Sb<sub>0.25</sub>, <em>a</em> ≈ 7.65 Å for Cu<sub>3−x</sub>As<sub>0.25</sub>Sb<sub>0.75</sub> (averaged values).</div><div>Cu<sub>3−x</sub>(As,Sb) forms either by a peritectic reaction for As-rich compositions, or congruently for the equiatomic Sb/As and Sb-rich compositions. The decomposition- or melting-temperature values decrease as a function of the Sb/As compositional ratio [<em>e.g</em>. peritectic at 710 °C for Cu<sub>3−x</sub>As<sub>0.75</sub>Sb<sub>0.25</sub> (Cu<sub>72</sub>As<sub>21</sub>Sb<sub>7</sub>), congruent melting at 690 °C for Cu<sub>3−x</sub>As<sub>0.50</sub>Sb<sub>0.50</sub> (Cu<sub>72</sub>As<sub>14</sub>Sb<sub>14</sub>), and at 675 °C for Cu<sub>3−x</sub>As<sub>0.25</sub>Sb<sub>0.75</sub> (Cu<sub>72</sub>As<sub>7</sub>Sb<sub>21</sub>)].</div><div>Physical properties (electrical resistivity and magnetic susceptibility) indicate that Cu<sub>3−x</sub>(As,Sb) behaves as a good metal with electrical resistivity decreasing as the Sb/As compositional ratio increases; a peculiar anomaly in the electrical resistivity behavior (heavy-fermions like) was observed at low temperature, the origin of which needs further investigation. The compound is a standard diamagnet.</div></div>","PeriodicalId":331,"journal":{"name":"Intermetallics","volume":"176 ","pages":"Article 108526"},"PeriodicalIF":4.3000,"publicationDate":"2024-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Crystallochemistry, thermodynamic and physical properties of the intermetallic compound Cu3−x(As,Sb)\",\"authors\":\"Marianne Mödlinger , Alessia Provino , Pavlo Solokha , Serena De Negri , Federico Caglieris , Michele Ceccardi , Cristina Bernini , Pietro Manfrinetti\",\"doi\":\"10.1016/j.intermet.2024.108526\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>During the investigation of the Cu-As-Sb ternary system, we identified the ternary intermetallic Cu<sub>3−x</sub>(As,Sb) compound. Its crystal structure was solved and refined by single crystal and powder X-ray diffraction. While the binary Cu<sub>3−x</sub>As and Cu<sub>3−x</sub>Sb phases crystallize in the hexagonal Cu<sub>3</sub>P-type (<em>hP</em>24, <em>P</em>6<sub>3</sub><em>cm</em>) and cubic anti-BiF<sub>3</sub>-type (<em>cF</em>16, <em>Fm</em><span><math><mover><mn>3</mn><mo>¯</mo></mover></math></span><em>m</em>), respectively, Cu<sub>3−x</sub>(As,Sb) adopts the cubic Cu<sub>6</sub>AsSb prototype (<em>cP</em>32, <em>Pm</em><span><math><mrow><mover><mn>3</mn><mo>‾</mo></mover></mrow></math></span><em>n</em>). Crystallochemical reasons lead to the exclusion that its structure could be of the UH<sub>3</sub>-type. Cu<sub>3−x</sub>(As,Sb) is isotypic with Cu<sub>12−x</sub>TeSb<sub>3</sub>; their crystal structure is a stuffed ternary derivative of the Cr<sub>3</sub>Si-type. SEM-EDX analyses reveal very large compositional ranges for this compound, mostly concerning the Sb/As ratio: 71.1−73.9 at.% Cu, 4.0−24.5 at.% As and 2.5−23.5 at.% Sb, corresponding to about Cu<sub>2.5-2.8</sub>As<sub>0.23-0.98</sub>Sb<sub>0.23-0.92</sub> (x = 0.2−0.5). The lattice parameter and, consequently, the unit cell volume regularly expand while increasing the Sb/As compositional ratio: <em>a</em> ≈ 7.47 Å for Cu<sub>3−x</sub>As<sub>0.75</sub>Sb<sub>0.25</sub>, <em>a</em> ≈ 7.65 Å for Cu<sub>3−x</sub>As<sub>0.25</sub>Sb<sub>0.75</sub> (averaged values).</div><div>Cu<sub>3−x</sub>(As,Sb) forms either by a peritectic reaction for As-rich compositions, or congruently for the equiatomic Sb/As and Sb-rich compositions. The decomposition- or melting-temperature values decrease as a function of the Sb/As compositional ratio [<em>e.g</em>. peritectic at 710 °C for Cu<sub>3−x</sub>As<sub>0.75</sub>Sb<sub>0.25</sub> (Cu<sub>72</sub>As<sub>21</sub>Sb<sub>7</sub>), congruent melting at 690 °C for Cu<sub>3−x</sub>As<sub>0.50</sub>Sb<sub>0.50</sub> (Cu<sub>72</sub>As<sub>14</sub>Sb<sub>14</sub>), and at 675 °C for Cu<sub>3−x</sub>As<sub>0.25</sub>Sb<sub>0.75</sub> (Cu<sub>72</sub>As<sub>7</sub>Sb<sub>21</sub>)].</div><div>Physical properties (electrical resistivity and magnetic susceptibility) indicate that Cu<sub>3−x</sub>(As,Sb) behaves as a good metal with electrical resistivity decreasing as the Sb/As compositional ratio increases; a peculiar anomaly in the electrical resistivity behavior (heavy-fermions like) was observed at low temperature, the origin of which needs further investigation. The compound is a standard diamagnet.</div></div>\",\"PeriodicalId\":331,\"journal\":{\"name\":\"Intermetallics\",\"volume\":\"176 \",\"pages\":\"Article 108526\"},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2024-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Intermetallics\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0966979524003455\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Intermetallics","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0966979524003455","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Crystallochemistry, thermodynamic and physical properties of the intermetallic compound Cu3−x(As,Sb)
During the investigation of the Cu-As-Sb ternary system, we identified the ternary intermetallic Cu3−x(As,Sb) compound. Its crystal structure was solved and refined by single crystal and powder X-ray diffraction. While the binary Cu3−xAs and Cu3−xSb phases crystallize in the hexagonal Cu3P-type (hP24, P63cm) and cubic anti-BiF3-type (cF16, Fmm), respectively, Cu3−x(As,Sb) adopts the cubic Cu6AsSb prototype (cP32, Pmn). Crystallochemical reasons lead to the exclusion that its structure could be of the UH3-type. Cu3−x(As,Sb) is isotypic with Cu12−xTeSb3; their crystal structure is a stuffed ternary derivative of the Cr3Si-type. SEM-EDX analyses reveal very large compositional ranges for this compound, mostly concerning the Sb/As ratio: 71.1−73.9 at.% Cu, 4.0−24.5 at.% As and 2.5−23.5 at.% Sb, corresponding to about Cu2.5-2.8As0.23-0.98Sb0.23-0.92 (x = 0.2−0.5). The lattice parameter and, consequently, the unit cell volume regularly expand while increasing the Sb/As compositional ratio: a ≈ 7.47 Å for Cu3−xAs0.75Sb0.25, a ≈ 7.65 Å for Cu3−xAs0.25Sb0.75 (averaged values).
Cu3−x(As,Sb) forms either by a peritectic reaction for As-rich compositions, or congruently for the equiatomic Sb/As and Sb-rich compositions. The decomposition- or melting-temperature values decrease as a function of the Sb/As compositional ratio [e.g. peritectic at 710 °C for Cu3−xAs0.75Sb0.25 (Cu72As21Sb7), congruent melting at 690 °C for Cu3−xAs0.50Sb0.50 (Cu72As14Sb14), and at 675 °C for Cu3−xAs0.25Sb0.75 (Cu72As7Sb21)].
Physical properties (electrical resistivity and magnetic susceptibility) indicate that Cu3−x(As,Sb) behaves as a good metal with electrical resistivity decreasing as the Sb/As compositional ratio increases; a peculiar anomaly in the electrical resistivity behavior (heavy-fermions like) was observed at low temperature, the origin of which needs further investigation. The compound is a standard diamagnet.
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