{"title":"网络物理系统中数字孪生的互操作性水平和挑战","authors":"Sarthak Acharya, Arif Ali Khan, Tero Päivärinta","doi":"10.1016/j.jii.2024.100714","DOIUrl":null,"url":null,"abstract":"<div><h3>Context:</h3><div>Industry 4.0/5.0 has brought together technologies like Internet of Things (IoTs), Industrial IoT (IIoT), Cyber–Physical Systems (CPS), Edge Computing, big data analytics, communication technologies (4G/5G/6G) and Digital Twins (DTs), aiming for more intelligent, interconnected systems. However, their real-time efficiency hinges on how well these components integrate and interact. This paper examines the interoperability levels and challenges of integrating Digital Twins within edge-enabled Cyber–Physical Systems.</div></div><div><h3>Objective:</h3><div>Our research explores the existing methods and frameworks for integrating multiple digital twins into a CPS setup. This study focuses on two key research objectives. The first is delineating interoperability levels within DT deployments in CPS setups. The second examines various interoperability challenges in integrating DTs in the context of CPS.</div></div><div><h3>Method:</h3><div>A literature survey is conducted on the existing scholarly literature, industrial use cases, and reports.</div></div><div><h3>Results:</h3><div>We identified 77 interoperability challenges and proposed an interoperability framework for DTs, involving six levels i.e. <em>technical, syntactic, semantic, pragmatic, dynamic</em> and <em>organizational</em>. We further categorized all the 77 challenges into 33 subthemes and mapped them across the 6 levels.</div></div><div><h3>Conclusions:</h3><div>The findings synthesize these challenges into a framework, offering a structured lens through which practitioners can view the adoption and effective use of interconnected DTs in CPS. This contribution is paving the way for future research and development endeavors, aiming to explore fully integrated, efficient, and intelligent CPS within the realm of Industry 4.0/5.0.</div></div>","PeriodicalId":55975,"journal":{"name":"Journal of Industrial Information Integration","volume":"42 ","pages":"Article 100714"},"PeriodicalIF":10.4000,"publicationDate":"2024-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interoperability levels and challenges of digital twins in cyber–physical systems\",\"authors\":\"Sarthak Acharya, Arif Ali Khan, Tero Päivärinta\",\"doi\":\"10.1016/j.jii.2024.100714\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><h3>Context:</h3><div>Industry 4.0/5.0 has brought together technologies like Internet of Things (IoTs), Industrial IoT (IIoT), Cyber–Physical Systems (CPS), Edge Computing, big data analytics, communication technologies (4G/5G/6G) and Digital Twins (DTs), aiming for more intelligent, interconnected systems. However, their real-time efficiency hinges on how well these components integrate and interact. This paper examines the interoperability levels and challenges of integrating Digital Twins within edge-enabled Cyber–Physical Systems.</div></div><div><h3>Objective:</h3><div>Our research explores the existing methods and frameworks for integrating multiple digital twins into a CPS setup. This study focuses on two key research objectives. The first is delineating interoperability levels within DT deployments in CPS setups. The second examines various interoperability challenges in integrating DTs in the context of CPS.</div></div><div><h3>Method:</h3><div>A literature survey is conducted on the existing scholarly literature, industrial use cases, and reports.</div></div><div><h3>Results:</h3><div>We identified 77 interoperability challenges and proposed an interoperability framework for DTs, involving six levels i.e. <em>technical, syntactic, semantic, pragmatic, dynamic</em> and <em>organizational</em>. We further categorized all the 77 challenges into 33 subthemes and mapped them across the 6 levels.</div></div><div><h3>Conclusions:</h3><div>The findings synthesize these challenges into a framework, offering a structured lens through which practitioners can view the adoption and effective use of interconnected DTs in CPS. This contribution is paving the way for future research and development endeavors, aiming to explore fully integrated, efficient, and intelligent CPS within the realm of Industry 4.0/5.0.</div></div>\",\"PeriodicalId\":55975,\"journal\":{\"name\":\"Journal of Industrial Information Integration\",\"volume\":\"42 \",\"pages\":\"Article 100714\"},\"PeriodicalIF\":10.4000,\"publicationDate\":\"2024-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Industrial Information Integration\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2452414X24001572\",\"RegionNum\":1,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Industrial Information Integration","FirstCategoryId":"94","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2452414X24001572","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS","Score":null,"Total":0}
Interoperability levels and challenges of digital twins in cyber–physical systems
Context:
Industry 4.0/5.0 has brought together technologies like Internet of Things (IoTs), Industrial IoT (IIoT), Cyber–Physical Systems (CPS), Edge Computing, big data analytics, communication technologies (4G/5G/6G) and Digital Twins (DTs), aiming for more intelligent, interconnected systems. However, their real-time efficiency hinges on how well these components integrate and interact. This paper examines the interoperability levels and challenges of integrating Digital Twins within edge-enabled Cyber–Physical Systems.
Objective:
Our research explores the existing methods and frameworks for integrating multiple digital twins into a CPS setup. This study focuses on two key research objectives. The first is delineating interoperability levels within DT deployments in CPS setups. The second examines various interoperability challenges in integrating DTs in the context of CPS.
Method:
A literature survey is conducted on the existing scholarly literature, industrial use cases, and reports.
Results:
We identified 77 interoperability challenges and proposed an interoperability framework for DTs, involving six levels i.e. technical, syntactic, semantic, pragmatic, dynamic and organizational. We further categorized all the 77 challenges into 33 subthemes and mapped them across the 6 levels.
Conclusions:
The findings synthesize these challenges into a framework, offering a structured lens through which practitioners can view the adoption and effective use of interconnected DTs in CPS. This contribution is paving the way for future research and development endeavors, aiming to explore fully integrated, efficient, and intelligent CPS within the realm of Industry 4.0/5.0.
期刊介绍:
The Journal of Industrial Information Integration focuses on the industry's transition towards industrial integration and informatization, covering not only hardware and software but also information integration. It serves as a platform for promoting advances in industrial information integration, addressing challenges, issues, and solutions in an interdisciplinary forum for researchers, practitioners, and policy makers.
The Journal of Industrial Information Integration welcomes papers on foundational, technical, and practical aspects of industrial information integration, emphasizing the complex and cross-disciplinary topics that arise in industrial integration. Techniques from mathematical science, computer science, computer engineering, electrical and electronic engineering, manufacturing engineering, and engineering management are crucial in this context.