通过双温沉积和基底退火提高 (111) 铂薄膜的导电性和结晶度

IF 5.3 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Scripta Materialia Pub Date : 2024-11-05 DOI:10.1016/j.scriptamat.2024.116442
Marshall B. Frye , Jonathan R. Chin , Matthew Barone , Steven E. Zeltmann , Lauren M. Garten
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引用次数: 0

摘要

开发具有亚纳米粗糙度的高导电性(111)取向铂薄膜沉积路线将为开发独特的六方和(111)取向立方材料提供一个平台。为在 Al2O3 上生长 (111) 取向铂薄膜提出了一种双温电子束沉积工艺,以同时诱导晶体纹理、提高导电性和降低表面粗糙度。在 700 °C 下沉积初始铂层可诱导纹理,随后在 500 °C 下沉积可促进平面生长。最终得到的 (111) 铂薄膜具有 0.004° 的窄摇摆曲线半最大值全宽、0.20 nm 的表面粗糙度和 8.99 × 106 S/m 的导电率,这些指标是目前其他沉积方法无法达到的。本研究开发的电子束沉积方法为提高铂作为导电基底的性能提供了一条途径。
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Enhancing the conductivity and crystallinity of (111) platinum films via a two-temperature deposition and substrate annealing
Developing routes to deposit highly conductive (111) oriented platinum films with sub-nanometer roughness will provide a platform to develop unique hexagonal and (111) oriented cubic materials. A two-temperature e-beam deposition process is proposed for the growth of (111) oriented platinum films on Al2O3 to simultaneously induce crystallographic texturing, improve conductivity, and reduce surface roughness. Depositing an initial platinum layer at 700 °C induces texturing then subsequently depositing at 500 °C promotes planar growth. The resulting (111) platinum films exhibit a narrow rocking curve full width at half maximum of 0.004°, a surface roughness of 0.20 nm, and conductivity of 8.99 × 106 S/m simultaneously—reaching metrics that are not currently available by other deposition methods. The e-beam deposition methodology developed in this study provides a route to increase the performance of platinum as a conductive substrate.
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来源期刊
Scripta Materialia
Scripta Materialia 工程技术-材料科学:综合
CiteScore
11.40
自引率
5.00%
发文量
581
审稿时长
34 days
期刊介绍: Scripta Materialia is a LETTERS journal of Acta Materialia, providing a forum for the rapid publication of short communications on the relationship between the structure and the properties of inorganic materials. The emphasis is on originality rather than incremental research. Short reports on the development of materials with novel or substantially improved properties are also welcomed. Emphasis is on either the functional or mechanical behavior of metals, ceramics and semiconductors at all length scales.
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