具有对齐结构和超高导热性的新型石墨烯-环氧树脂复合材料

IF 5.1 Q1 POLYMER SCIENCE ACS Macro Letters Pub Date : 2024-11-06 DOI:10.1002/adfm.202412534
Zhenqian Ma, Jinyue Wang, Zhenliang Hao, Jingjie Dai, Xiangyu Zhu, He Zheng, Xiongjun Liu, Hailong Zhang, Zhaoping Lu
{"title":"具有对齐结构和超高导热性的新型石墨烯-环氧树脂复合材料","authors":"Zhenqian Ma, Jinyue Wang, Zhenliang Hao, Jingjie Dai, Xiangyu Zhu, He Zheng, Xiongjun Liu, Hailong Zhang, Zhaoping Lu","doi":"10.1002/adfm.202412534","DOIUrl":null,"url":null,"abstract":"Because of the surge in the power density of electronic devices, there is an urgent need for improvements in the thermal conductivity of packaging materials. Nowadays, epoxy composites supplemented with thermally conductive fillers are widely used for this purpose, but unfortunately, none of them can satisfactorily meet industrial requirements. Herein, this article reports on a novel method to prepare well-shaped and highly ordered graphene-epoxy composite architecture; that is, the epoxy infiltrates into tubular graphene columns that have been restored to the high thermally conductive structure of graphene. As a result, the newly developed graphene-epoxy composite exhibits record-high thermal conductivity of 69.74 W m<sup>−1</sup> K<sup>−1</sup> with filler content of only 11.22 wt.%. The unprecedentedly high thermal conductivity stems from the construction of thermally conductive channels and restoration of the inherent π–π conjugate structure of graphene. These findings not only offer a breakthrough in packaging materials with significantly enhanced thermal conductivity but also provide a promising avenue for the development of other advanced graphene-added composites.","PeriodicalId":18,"journal":{"name":"ACS Macro Letters","volume":"79 1","pages":""},"PeriodicalIF":5.1000,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel Graphene-Epoxy Composite with Aligned Architecture and Ultrahigh Thermal Conductivity\",\"authors\":\"Zhenqian Ma, Jinyue Wang, Zhenliang Hao, Jingjie Dai, Xiangyu Zhu, He Zheng, Xiongjun Liu, Hailong Zhang, Zhaoping Lu\",\"doi\":\"10.1002/adfm.202412534\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Because of the surge in the power density of electronic devices, there is an urgent need for improvements in the thermal conductivity of packaging materials. Nowadays, epoxy composites supplemented with thermally conductive fillers are widely used for this purpose, but unfortunately, none of them can satisfactorily meet industrial requirements. Herein, this article reports on a novel method to prepare well-shaped and highly ordered graphene-epoxy composite architecture; that is, the epoxy infiltrates into tubular graphene columns that have been restored to the high thermally conductive structure of graphene. As a result, the newly developed graphene-epoxy composite exhibits record-high thermal conductivity of 69.74 W m<sup>−1</sup> K<sup>−1</sup> with filler content of only 11.22 wt.%. The unprecedentedly high thermal conductivity stems from the construction of thermally conductive channels and restoration of the inherent π–π conjugate structure of graphene. These findings not only offer a breakthrough in packaging materials with significantly enhanced thermal conductivity but also provide a promising avenue for the development of other advanced graphene-added composites.\",\"PeriodicalId\":18,\"journal\":{\"name\":\"ACS Macro Letters\",\"volume\":\"79 1\",\"pages\":\"\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2024-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Macro Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1002/adfm.202412534\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Macro Letters","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/adfm.202412534","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0

摘要

由于电子设备的功率密度急剧增加,因此迫切需要改善包装材料的导热性能。目前,添加导热填料的环氧树脂复合材料已被广泛应用,但遗憾的是,它们都无法满足工业要求。本文报告了一种制备形状良好且高度有序的石墨烯-环氧复合材料结构的新方法,即环氧渗入管状石墨烯柱中,恢复石墨烯的高导热结构。因此,新开发的石墨烯-环氧复合材料的热导率达到了创纪录的 69.74 W m-1 K-1,而填料含量仅为 11.22 wt.%。前所未有的高导热率源于导热通道的构建以及石墨烯固有的 π-π 共轭结构的恢复。这些发现不仅为具有显著增强导热性的包装材料提供了一个突破口,而且为开发其他添加石墨烯的先进复合材料提供了一个前景广阔的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

摘要图片

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Novel Graphene-Epoxy Composite with Aligned Architecture and Ultrahigh Thermal Conductivity
Because of the surge in the power density of electronic devices, there is an urgent need for improvements in the thermal conductivity of packaging materials. Nowadays, epoxy composites supplemented with thermally conductive fillers are widely used for this purpose, but unfortunately, none of them can satisfactorily meet industrial requirements. Herein, this article reports on a novel method to prepare well-shaped and highly ordered graphene-epoxy composite architecture; that is, the epoxy infiltrates into tubular graphene columns that have been restored to the high thermally conductive structure of graphene. As a result, the newly developed graphene-epoxy composite exhibits record-high thermal conductivity of 69.74 W m−1 K−1 with filler content of only 11.22 wt.%. The unprecedentedly high thermal conductivity stems from the construction of thermally conductive channels and restoration of the inherent π–π conjugate structure of graphene. These findings not only offer a breakthrough in packaging materials with significantly enhanced thermal conductivity but also provide a promising avenue for the development of other advanced graphene-added composites.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
CiteScore
10.40
自引率
3.40%
发文量
209
审稿时长
1 months
期刊介绍: ACS Macro Letters publishes research in all areas of contemporary soft matter science in which macromolecules play a key role, including nanotechnology, self-assembly, supramolecular chemistry, biomaterials, energy generation and storage, and renewable/sustainable materials. Submissions to ACS Macro Letters should justify clearly the rapid disclosure of the key elements of the study. The scope of the journal includes high-impact research of broad interest in all areas of polymer science and engineering, including cross-disciplinary research that interfaces with polymer science. With the launch of ACS Macro Letters, all Communications that were formerly published in Macromolecules and Biomacromolecules will be published as Letters in ACS Macro Letters.
期刊最新文献
Issue Editorial Masthead Highly Alternating Copolymer of [1.1.1]Propellane and Perfluoro Vinyl Ether: Forming a Hydrophobic and Oleophobic Surface with <50% Fluorine Monomer Content. Semiaromatic Polyester-Ethers with Tunable Degradation Profiles. Eutectic Strategy for the Solvent-Free Synthesis of Hydrophobic Cellulosic Cross-Linked Networks with Broad Multifunctional Applications. Poly(arylene ether)s via Cu(II)-Catalysis.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1