{"title":"固态电路方向委员会 \"利用集成电路思考影响力 \"研讨会：面向下一代人工智能系统的系统、电路、器件和封装协同优化 [学会新闻］","authors":"Atsutake Kosuge;Kyuho Lee","doi":"10.1109/MSSC.2024.3457088","DOIUrl":null,"url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"111-113"},"PeriodicalIF":0.0000,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752791","citationCount":"0","resultStr":"{\"title\":\"Solid-State Circuit Directions Committee’s “Think Impact With ICs” Workshop on System, Circuit, Device, and Packaging Co-Optimization for Next Generation AI Systems [Society News]\",\"authors\":\"Atsutake Kosuge;Kyuho Lee\",\"doi\":\"10.1109/MSSC.2024.3457088\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.\",\"PeriodicalId\":100636,\"journal\":{\"name\":\"IEEE Solid-State Circuits Magazine\",\"volume\":\"16 4\",\"pages\":\"111-113\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752791\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Solid-State Circuits Magazine\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10752791/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Solid-State Circuits Magazine","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10752791/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Solid-State Circuit Directions Committee’s “Think Impact With ICs” Workshop on System, Circuit, Device, and Packaging Co-Optimization for Next Generation AI Systems [Society News]
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
