实施骨干架构对 X 射线图像中骨折分割的影响

IF 5.1 2区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY Engineering Science and Technology-An International Journal-Jestech Pub Date : 2024-11-01 DOI:10.1016/j.jestch.2024.101883
Salih Turk , Ozkan Bingol , Ahmet Coskuncay , Tolga Aydin
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引用次数: 0

摘要

X 射线成像因其经济实惠、快速处理能力、广泛的可及性和易用性而被广泛用于骨折检测。尽管具有这些优势,但要对 X 射线图像进行复杂的分析,就必须采用先进的计算技术,以充分利用其丰富的信息内容。值得注意的是,这些图像的精确分割在帮助医疗专业人员进行精确诊断和有效治疗规划方面起着至关重要的作用。本研究探讨了集成不同骨干架构对 X 光图像中骨折分割任务的影响。具体来说,研究重点是通过将 ResNet50、ResNet101 和 MobileNetV3 等预先训练好的网络整合到编码器组件中来增强广泛使用的 DeepLabV3 模型,从而提高特征提取和分割精度。FracAtlas 数据集因其规模小和来自不同解剖区域的骨折的多样性而具有独特的挑战性,该数据集被用于模型评估。我们采用了数据扩增技术来扩展数据集,并开发了一个额外的子集,重点关注断裂区域的裁剪图像。对模型进行了 50 个历时的训练,并使用联合交叉(IoU)、损失值和 Dice 分数等指标对模型的性能进行了评估。结果表明,基于 ResNet 骨干的 DeepLabV3 模型在原始数据集上的 IoU 值超过了 0.93,在增强和裁剪数据集上表现出色,AUC 值高达 0.99。研究还强调了模型的计算复杂度,其中 ResNet101 的时间复杂度最高,而 MobileNetV3 在处理时间和内存消耗方面效率最高。
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The impact of implementing backbone architectures on fracture segmentation in X-ray images
X-ray imaging is widely utilized for the detection of bone fractures due to its affordability, rapid processing capabilities, broad accessibility, and ease of use. Despite these advantages, the intricate analysis of X-ray images necessitates advanced computational techniques to fully exploit their rich informational content. Notably, accurate segmentation of these images plays a critical role in aiding medical professionals with precise diagnoses and effective treatment planning. This study examines the impact of integrating different backbone architectures for the task of fracture segmentation in X-ray images. Specifically, the research focuses on enhancing the widely-used DeepLabV3 model by incorporating pre-trained networks such as ResNet50, ResNet101, and MobileNetV3 into the encoder component to improve feature extraction and segmentation accuracy. The FracAtlas dataset, which presents unique challenges due to its small size and the diversity of fractures from various anatomical regions, was employed for model evaluation. Data augmentation techniques were implemented to expand the dataset, and an additional subset focusing on cropped images of fracture areas was developed. The models were trained over 50 epochs, and their performance was assessed using metrics such as Intersection over Union (IoU), loss values, and Dice scores. The results indicate that the DeepLabV3 model with ResNet-based backbones achieved IoU values exceeding 0.93 on the original dataset and demonstrated outstanding performance on the augmented and cropped datasets, with AUC values reaching up to 0.99. The study also highlights the computational complexity of the models, with ResNet101 exhibiting the highest time complexity, while MobileNetV3 was the most efficient in terms of processing time and memory consumption.
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来源期刊
Engineering Science and Technology-An International Journal-Jestech
Engineering Science and Technology-An International Journal-Jestech Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.20
自引率
3.50%
发文量
153
审稿时长
22 days
期刊介绍: Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology. The scope of JESTECH includes a wide spectrum of subjects including: -Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing) -Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences) -Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)
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